Inventor
Stephen H. Black
Inventor
Buellton, CA, US
Overview
Patents· 41 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices11%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems11%
H01LSemiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light7%
F23RGenerating combustion products of high pressure or high velocity, e.g. gas-turbine combustion chambers5%
H04NPictorial communication, e.g. television5%
F02CGas-turbine plants3%
F23DBurners3%
PatentTitleYear
10,315,918Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays201910,262,913Wafer level package solder barrier used as vacuum getter20199,966,320Wafer level package solder barrier used as vacuum getter20189,865,519'Use of an external getter to reduce package pressure'20189,708,181'Hermetically sealed package having stress reducing layer'20179,570,321'Use of an external getter to reduce package pressure'20179,520,332'Wafer level package solder barrier used as vacuum getter'20169,427,776'Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays'20169,407,820'Method and apparatus for inhibiting diversion of devices using an embedded accelerometer'20169,334,154'Hermetically sealed package having stress reducing layer'20169,277,142'Infrared thermal imaging system and method'20169,267,691'Quick disconnect combustion endcover'20169,227,839'Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling'20169,196,556'Getter structure and method for forming such structure'20159,187,312'Integrated bondline spacers for wafer level packaged circuit devices'20159,174,836'Integrated bondline spacers for wafer level packaged circuit devices'20159,105,800'Method of forming deposited patterns on a surface'20159,093,444'Wafer level package solder barrier used as vacuum getter'20159,022,584'Protecting an optical surface'20158,980,676'Fabrication of window cavity cap structures in wafer level packaging'20158,884,815'Antenna-coupled imager having pixels with integrated lenslets'20148,809,784'Incident radiation detector packaging'20148,736,045'Integrated bondline spacers for wafer level packaged circuit devices'20148,653,467'Multichip packaging for imaging system'20148,608,894'Wafer level packaged focal plane array'20138,586,926'Antenna-coupled antenna arrays'20138,511,823'Imaging system'20138,294,103'System and method for viewing an area using an optical system positioned inside of a dewar'20128,044,355'System and method for viewing an area using an optical system positioned inside of a dewar'20116,885,002'IRFPA ROIC with dual TDM reset integrators and sub-frame averaging functions per unit cell'20056,484,505'Combustor liner cooling thimbles and related method'20026,438,961'Swozzle based burner tube premixer including inlet air conditioner for low emissions combustion'20026,344,651'Differential current mode output circuit for electro-optical sensor arrays'20026,288,387'Apparatus and method for performing optical signal intensity correction in electro-optical sensor arrays'20016,205,765'Apparatus and method for active control of oscillations in gas turbine combustors'20016,133,596'Near complete charge transfer device'20006,123,273'Dual-fuel nozzle for inhibiting carbon deposition onto combustor surfaces in a gas turbine'20005,896,742'Tapered cross-fire tube for gas turbine combustors'19995,833,141'Anti-coking dual-fuel nozzle for a gas turbine combustor'19985,211,004'Apparatus for reducing fuel/air concentration oscillations in gas turbine combustors'19935,051,747'Interface for cables'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2016Patents assigned to GEN ELECTRIC (8)· patent assignee history
1993–2016Based in Duanesburg, NY, US· patent location history
2000–2019Patents assigned to RAYTHEON CO (32)· patent assignee history
2000–2002Patents assigned to INDIGO SYSTEMS CORP (3)· patent assignee history
2000–2017Based in Buellton, CA, US· patent location history
2012–2016Patents assigned to BLACK STEPHEN H (10)· patent assignee history
2013–2014Patents assigned to GRITZ MICHAEL A (3)· patent assignee history
2013–2015Based in Buelton, CA, US· patent location history
2014–2015Based in Goleta, CA, US· patent location history
2016–2019Based in Tennessee Ridge, TN, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RAYTHEON CO | 32 | 2000–2019 |
| BLACK STEPHEN Hself | 10 | 2012–2016 |
| GEN ELECTRIC | 8 | 1993–2016 |
| GRITZ MICHAEL A | 3 | 2013–2014 |
| INDIGO SYSTEMS CORP | 3 | 2000–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Buellton, California, US | 21 | 2000–2017 |
| Duanesburg, New York, US | 7 | 1993–2016 |
| Tennessee Ridge, TN, US | 5 | 2016–2019 |
| Goleta, California, US | 3 | 2014–2015 |
| Buelton, California, US | 2 | 2013–2015 |