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Inventor

Wen Wei

Inventor
Hsinchu, TW

Overview

5→
Patents
2000–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
G06FElectric digital data processing11%
H04LTransmission of digital information, e.g. telegraphic communication11%
H04WWireless communication networks11%
LOC1411%
LOC2311%
PatentTitleYear
10,985,137Stacked integrated circuit structure and method of forming202110,964,667Stacked integrated circuit structure and method of forming202110,715,542Mobile application risk analysis2020D0883462Aroma diffuser2020D0434743'Mobile phone'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000Patents assigned to GVC CORP (1)· patent assignee history
2000–2020Based in Taipei, TW· patent location history
2020Patents assigned to FIREEYE INC (1)· patent assignee history
2020Patents assigned to TEST RITE INT CO LTD (1)· patent assignee history
2020Based in Saratoga, CA, US· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22021
FIREEYE INC12020
GVC CORP12000
TEST RITE INT CO LTD12020
Locations
LocationPatentsSpan
Hsinchu, TW22021
Taipei, TW22000–2020
Saratoga, California, US12020