LexDanaLexDanabeta
Inventor

Rickie C. Lake

Inventor
Eagle, ID, US

Overview

134→
Patents
1994–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 134 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification20%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
G06KGraphical data reading8%
H05KPrinted circuits8%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
Y02PClimate change mitigation technologies in the production or processing of goods4%
A01MCatching, trapping or scaring of animals3%
G01RMeasuring electric variables3%
G01SRadio direction-finding3%
PatentTitleYear
9,998,643Methods of forming curved image sensors20189,737,947'Microfeature workpieces having alloyed conductive structures, and associated methods'20179,612,409'Hermetic sealing of optical module'20179,153,491'Methods for forming conductive elements and vias on substrates and for forming multi-chip modules'20158,835,293'Methods for forming conductive elements and vias on substrates'20148,415,233'Wafer processing'2013RE043940'Method and apparatus for RFID communication'2013RE043935'Method and apparatus for RFID communication'2013RE043918'Method and apparatus for RFID communication'20138,183,151'Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom'2012RE042872'Method and apparatus for communicating with RFID devices coupled to a roll of flexible material'2011RE042773'Method of manufacturing an enclosed transceiver'20117,972,940'Wafer processing'20117,968,042'Method and apparatus for step-and-repeat molding'20117,927,916'Optic wafer with reliefs, wafer assembly including same and methods of dicing wafer assembly'20117,888,758'Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure'20117,723,741'Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers'20107,687,916'Semiconductor substrates including vias of nonuniform cross-section and associated structures'20107,534,053'Optoelectronic housings and methods of assembling optoelectronic packages'20097,511,616'Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit'20097,425,507'Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures'20087,405,155'Circuit package and method of plating the same'2008RE040137'Methods for forming integrated circuits within substrates'20087,223,626'Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers'20077,199,449'Wafer backside removal to complete through-holes and provide wafer singulation during the formation of a semiconductor device'20077,194,182'Methods and apparatuses using a fiber-flexure induction soldering station'20077,076,123'Optoelectronic package having a transmission line between electrical components and optical components'20067,019,394'Circuit package and method of plating the same'20066,950,594'Method of attaching an optical fiber to a flexure'20056,902,689'Epoxy, epoxy system, and method of forming a conductive adhesive connection'20056,885,089'Battery powerable apparatus, radio frequency communication device, and electric circuit'20056,881,294'Method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit'20056,882,284'Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methods'20056,821,032'Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs'20046,773,171'Optoelectronic housings and methods of assembling optoelectronic packages'20046,666,379'Method of fabricating a wireless radio frequency identification device'20036,630,887'Electrical apparatuses, and methods of forming electrical apparatuses'20036,522,023'RADIO FREQUENCY-TRANSMISSIVE COMPOSITIONS, METHODS OF FORMING RADIO FREQUENCY-TRANSMISSIVE COMPOSITIONS, MICROELECTRONIC DEVICES, WIRELESS RADIO FREQUENCY COMMUNICATION DEVICES, AND METHODS OF FORMING MICROELECTRONIC DEVICES, WIRELESS RADIO FREQUENCY COMMUNICATION DEVICES'20036,515,591'Termite sensing methods'20036,487,681'In-sheet transceiver testing'20026,471,129'Method of fabricating a remote intelligent communications device'20026,458,482'Battery with insulative member'20026,458,234'Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate'20026,451,477'Button-type battery constructions'20026,440,183'Methods of insulating button-type batteries'20026,392,545'Electrical apparatuses, and methods of forming electrical apparatuses'20026,375,780'Method of manufacturing an enclosed transceiver'20026,376,922'RADIO FREQUENCY-TRANSMISSIVE COMPOSITIONS, METHODS OF FORMING RADIO FREQUENCY-TRANSMISSIVE COMPOSITIONS, MICROELECTRONIC DEVICES WIRELESS RADIO FREQUENCY COMMUNICATION DEVICES, AND METHODS OF FORMING MICROELECTRONIC DEVICES, WIRELESS RADIO FREQUENCY COMMUNICATION DEVICES'20026,373,391'Devices for sensing changes in environments proximate the devices, devices for sensing termites, and methods for sensing termites'20026,359,561'Method of manufacturing and testing an electronic device, and an electronic device'20026,344,792'Method of manufacturing and testing an electronic device, and a electronic device'20026,329,213'Methods for forming integrated circuits within substrates'20016,325,294'Method of manufacturing an enclosed transceiver'20016,326,544'Polymer based circuit'20016,323,772'Devices for sensing termites and other living organisms, and methods of forming devices for sensing termites'20016,313,748'Electrical apparatuses, termite sensing apparatuses, methods of forming electrical apparatuses, and methods of sensing termites'20016,309,954'Methods of forming flip chip bumps and related flip chip bump constructions'20016,304,185'Devices for sensing living organisms, devices for sensing termites, methods of forming devices for sensing termites, and methods for sensing termites'20016,281,799'Devices for sensing changes in environments proximate the devices, devices for sensing termites, and methods for sensing termites'20016,271,801'Embedded circuits'20016,255,959'Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methods'20016,251,211'Circuitry interconnection method'20016,248,471'Methods of forming thin-profile battery electrode connection members'20016,243,014'Electrical apparatuses, termite sensing apparatuses, and methods of forming electrical apparatuses'20016,241,915'Epoxy, epoxy system, and method of forming a conductive adhesive connection'20016,235,423'Button-type batteries with an insulating jacket'20016,231,625'Methods of insulating a thin-profile battery'20016,229,441'Communication devices, radio frequency identification devices, methods of forming a communication device, and methods of forming a radio frequency identification device'20016,220,516'Method of manufacturing an enclosed transceiver'20016,211,785'Method of manufacturing and testing an electronic device, and an electronic device'20016,210,828'Thin-profile battery electrode connection members, button-type battery electrode connection members, thin profile battery constructions and button-type battery constructions'20016,207,317'Button-type battery constructions'20016,177,859'Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus'20016,167,614'Method of manufacturing and testing an electronic device, and an electronic device'20016,166,915'Electronic circuits and circuit boards'20006,161,281'Battery mounting apparatuses, electronic devices, and methods of forming electrical connections'20006,114,239'Electronic circuit bonding interconnect component and flip chip interconnect bond'20006,114,447'Radio frequency-transmissive compositions, methods of forming radio frequency-transmissive compositions'2000RE036843'Polymer-lithium batteries and improved methods for manufacturing batteries'20006,104,280'Method of manufacturing and testing an electronic device, and an electronic device'20006,100,805'Devices for sensing termites and other living organisms, and methods of forming devices for sensing termites'20006,089,458'Method of processing liquids, epoxy fabrication method, method of fabricating a radio frequency intelligent communication device, and method involving a mixture of different liquids'20006,087,731'Methods of forming flip chip bumps and related flip chip bump constructions'20006,083,773'Methods of forming flip chip bumps and related flip chip bump constructions'20006,081,243'Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices'20006,078,791'Radio frequency identification transceiver and antenna'20006,067,056'Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices'20006,062,722'Fluid mixing and withdrawing methods'20006,045,652'Method of manufacturing an enclosed transceiver'20006,043,745'Electronic devices and methods of forming electronic devices'20006,031,459'Wireless communication devices, radio frequency identification devices, and methods of forming wireless communication devices and radio frequency identification devices'20006,030,423'Thin profile battery bonding method and method of conductively interconnecting electronic components'20006,030,721'Batteries comprising an ink layer'20006,025,089'Battery comprising ink'20006,016,746'Flip chip screen printing method'20006,004,359'Methods of forming battery electrodes'19995,998,061'Thin-profile battery electrode connection members, button-type battery electrode connection members, thin-profile battery constructions and button-type battery constructions'19995,987,739'Method of making a polymer based circuit'19995,986,569'Radio frequency identification system, radio frequency identification device package, and method of use of radio frequency identification device'19995,981,102'Thin profile battery apparatus, battery powerable apparatus, radio frequency communication device, and method of forming battery powerable apparatus'19995,983,363'In-sheet transceiver testing'19995,978,230'Battery mounting apparatuses, electronic devices, and methods of forming electrical connections'19995,972,152'Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier'19995,963,177'Methods of enhancing electronmagnetic radiation properties of encapsulated circuit, and related devices'19995,937,512'Method of forming a circuit board'19995,906,661'Battery constructions and method for forming such battery constructions'19995,907,477'Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant'19995,900,333'Method of forming a battery and such battery formed'19995,865,859'Method of forming batteries with printed cathode layers'19995,804,876'Electronic circuit bonding interconnect component and flip chip interconnect bond'19985,779,839'Method of manufacturing an enclosed transceiver'19985,776,278'Method of manufacturing an enclosed transceiver'19985,747,191'Multilayered battery having a cured conductive ink layer'19985,747,190'Multilayered battery having a cured conductive ink layer'19985,735,912'Methods of forming battery electrodes'19985,735,914'Method for forming battery constructions'19985,730,761'Methods of producing thin profile batteries and a plurality of battery terminal housing members'1998RE035746'Battery package and method using flexible polymer films having a deposited layer of an inorganic material'19985,705,294'Method of forming a battery and battery'19985,663,598'Electrical circuit bonding interconnect component and flip chip interconnect bond'19975,658,684'Battery having orifices for connection with electrode terminals'19975,652,071'Method of forming a button-type battery and button-type battery'19975,642,561'Methods of producing thin profile batteries and battery terminal housing members'19975,629,108'Method of forming a battery and battery'19975,624,468'Method for fabricating a leadless battery employing an alkali metal anode and polymer film inks'19975,612,513'Article and method of manufacturing an enclosed electrical circuit using an encapsulant'19975,605,547'Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor'19975,603,157'Methods of producing button-type batteries and a plurality of battery terminal housing members'19975,591,680'Formation methods of opaque or translucent films'19975,536,596'Method of forming a button-type battery and button-type battery'19965,480,834'Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent'19965,448,110'Enclosed transceiver'19955,350,645'Polymer-lithium batteries and improved methods for manufacturing batteries'19945,326,652'Battery package and method using flexible polymer films having a deposited layer of an inorganic material'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2000Based in Boise, ID, US· patent location history
1995–2000Patents assigned to MICRON COMMUNICATIONS INC (41)· patent assignee history
1995–2014Based in Eagle, ID, US· patent location history
1997–2017Patents assigned to MICRON TECHNOLOGY INC (71)· patent assignee history
2004–2017Patents assigned to INTEL CORP (9)· patent assignee history
2004–2017Based in Sunnyvale, CA, US· patent location history
2007–2018Based in Meridian, ID, US· patent location history
2011–2013Patents assigned to ROUND ROCK RES LLC (5)· patent assignee history
2012–2017Patents assigned to LAKE RICKIE C (7)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC711997–2017
MICRON COMMUNICATIONS INC411995–2000
INTEL CORP92004–2017
LAKE RICKIE Cself72012–2017
ROUND ROCK RES LLC52011–2013
Locations
LocationPatentsSpan
Eagle, ID, US1011995–2014
Meridian, ID, US162007–2018
Sunnyvale, California, US92004–2017
Boise, ID, US81994–2000