Inventor
THOMAS WORKMAN
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H05KPrinted circuits8%
H10BElectronic memory devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
12,563,749Stacked electronic devices202612,550,799Direct bonding methods and structures202612,532,432Hotspot mitigation in fluid cooling202612,368,087Embedded cooling systems for advanced device packaging and methods of manufacturing the same202512,341,083Electronic device cooling structures bonded to semiconductor elements202512,272,677Direct bonded stack structures for increased reliability and improved yield in microelectronics202512,191,233Embedded cooling systems and methods of manufacturing embedded cooling systems202512,080,672Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive202411,955,463Direct bonded stack structures for increased reliability and improved yield in microelectronics202411,296,053Direct bonded stack structures for increased reliability and improved yield in microelectronics2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to INVENSAS BONDING TECH INC (1)· patent assignee history
2022–2026Based in US· patent location history
2024–2026Patents assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC (9)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC | 9 | 2024–2026 |
| INVENSAS BONDING TECH INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2022–2026 |