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Inventor

Dominic J. Benvegnu

Inventor
La Honda, CA, US

Overview

97→
Patents
1999–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 97 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing35%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
B24DTools for grinding, buffing or sharpening11%
H01LSemiconductor devices7%
G01BMeasuring length, thickness or similar linear dimensions5%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
G05BControl or regulating systems in general4%
G16ZInformation and communication technology [ict] specially adapted for specific application fields, not otherwise provided for2%
G06TImage data processing or generation, in general2%
H04NPictorial communication, e.g. television1%
PatentTitleYear
11,100,628Thickness measurement of substrate using color metrology202111,072,050Polishing pad with window and manufacturing methods thereof202111,017,524Thickness measurement of substrate using color metrology202110,948,900Display of spectra contour plots versus time for semiconductor processing system control202110,766,119Spectra based endpointing for chemical mechanical polishing202010,741,459Inductive monitoring of conductive loops202010,565,701Color imaging for CMP monitoring202010,325,364Thickness measurement of substrate using color metrology201910,276,460Endpointing detection for chemical mechanical polishing based on spectrometry201910,103,073Inductive monitoring of conductive trench depth20189,886,026'Endpoint method using peak location of spectra contour plots versus time'20189,799,578'Peak-based endpointing for chemical mechanical polishing'20179,754,846'Inductive monitoring of conductive trench depth'20179,607,910'Limiting adjustment of polishing rates during substrate polishing'20179,583,405'Endpointing detection for chemical mechanical polishing based on spectrometry'20179,564,377'Peak-based endpointing for chemical mechanical polishing'20179,496,190'Feedback of layer thickness timing and clearance timing for polishing control'20169,490,186'Limiting adjustment of polishing rates during substrate polishing'20169,375,824'Adjustment of polishing rates during substrate polishing with predictive filters'20169,346,146'Adjusting polishing rates by using spectrographic monitoring of a substrate during processing'20169,308,618'Linear prediction for filtering of data during in-situ monitoring of polishing'20169,233,450'Optical detection of metal layer clearance'20169,227,293'Multi-platen multi-head polishing architecture'20169,186,774'X-ray metrology for control of polishing'20159,168,630'User-input functions for data sequences in polishing endpoint detection'20159,142,466'Using spectra to determine polishing endpoints'20159,138,858'Thin polishing pad with window and molding process'20159,117,751'Endpointing detection for chemical mechanical polishing based on spectrometry'20159,095,952'Reflectivity measurements during polishing using a camera'20159,073,169'Feedback control of polishing using optical detection of clearance'20159,056,383'Path for probe of spectrographic metrology system'20158,992,286'Weighted regression of thickness maps from spectral data'20158,989,890'GST film thickness monitoring'20158,977,379'Endpoint method using peak location of spectra contour plots versus time'20158,944,884'Fitting of optical model to measured spectrum'20158,942,842'Varying optical coefficients to generate spectra for polishing control'20158,932,107'Gathering spectra from multiple optical heads'20158,892,568'Building a library of spectra for optical monitoring'20148,874,250'Spectrographic monitoring of a substrate during processing using index values'20148,815,109'Spectra based endpointing for chemical mechanical polishing'20148,758,086'Friction sensor for polishing system'20148,755,928'Automatic selection of reference spectra library'20148,751,033'Adaptive tracking spectrum features for endpoint detection'20148,718,810'Semi-quantitative thickness determination'20148,679,979'Using optical metrology for within wafer feed forward process control'20148,657,646'Endpoint detection using spectrum feature trajectories'20148,591,698'Peak-based endpointing for chemical mechanical polishing'20138,585,790'Treatment of polishing pad window'20138,579,675'Methods of using optical metrology for feed back and feed forward process control'20138,569,174'Using spectra to determine polishing endpoints'20138,563,335'Method of controlling polishing using in-situ optical monitoring and fourier transform'20138,562,389'Thin polishing pad with window and molding process'20138,554,351'Spectrographic monitoring of a substrate during processing using index values'20138,535,115'Gathering spectra from multiple optical heads'20138,518,827'Spectrum based endpointing for chemical mechanical polishing'20138,475,228'Polishing pad with partially recessed window'20138,393,940'Molding windows in thin pads'20138,393,933'Polishing pad and system with window support'20138,369,978'Adjusting polishing rates by using spectrographic monitoring of a substrate during processing'20138,352,061'Semi-quantitative thickness determination'20138,342,906'Friction sensor for polishing system'20138,292,693'Using optical metrology for wafer to wafer feed back process control'20128,260,446'Spectrographic monitoring of a substrate during processing using index values'20128,202,738'Endpoint method using peak location of modified spectra'20128,125,654'Methods and apparatus for measuring substrate edge thickness during polishing'20128,088,298'Spectra based endpointing for chemical mechanical polishing'20128,039,397'Using optical metrology for within wafer feed forward process control'20118,014,004'Determining physical property of substrate'20117,998,358'Peak-based endpointing for chemical mechanical polishing'20117,952,708'High throughput measurement system'20117,942,724'Polishing pad with window having multiple portions'20117,938,714'Polishing pad assembly with glass or crystalline window'20117,931,522'Removable optical monitoring system for chemical mechanical polishing'20117,840,375'Methods and apparatus for generating a library of spectra'20107,774,086'Substrate thickness measuring during polishing'20107,768,659'Determining copper concentration in spectra'20107,764,377'Spectrum based endpointing for chemical mechanical polishing'20107,746,485'Determining physical property of substrate'20107,727,049'Friction sensor for polishing system'20107,657,342'Substrate thickness measuring during polishing'20107,651,385'Polishing system with optical head'20107,614,936'Spectrum based endpointing for chemical mechanical polishing'20097,614,933'Polishing pad assembly with glass or crystalline window'20097,547,243'Method of making and apparatus having polishing pad with window'20097,513,818'Polishing endpoint detection system and method using friction sensor'20097,444,198'Determining physical property of substrate'20087,409,260'Substrate thickness measuring during polishing'20087,406,394'Spectra based endpointing for chemical mechanical polishing'20087,306,507'Polishing pad assembly with glass or crystalline window'20077,264,536'Polishing pad with window'20077,226,339'Spectrum based endpointing for chemical mechanical polishing'20077,210,980'Sealed polishing pad, system and methods'20077,195,535'Metrology for chemical mechanical polishing'20077,163,437'System with sealed polishing pad'20077,120,553'Iso-reflectance wavelengths'20067,112,119'Sealed polishing pad methods'20065,900,130'Method for sample injection in microchannel device'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2021Based in La Honda, CA, US· patent location history
2006–2021Patents assigned to APPLIED MATERIALS INC (95)· patent assignee history
2012–2016Patents assigned to BENVEGNU DOMINIC J (33)· patent assignee history
2012–2015Patents assigned to SWEDEK BOGUSLAW A (28)· patent assignee history
2012–2016Patents assigned to DAVID JEFFREY DRUE (20)· patent assignee history
2012–2015Patents assigned to LEE HARRY Q (13)· patent assignee history
2014Based in Cupertino, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC952006–2021
BENVEGNU DOMINIC Jself332012–2016
SWEDEK BOGUSLAW A282012–2015
DAVID JEFFREY DRUE202012–2016
LEE HARRY Q132012–2015
Locations
LocationPatentsSpan
La Honda, California, US961999–2021
Cupertino, California, US12014