Inventor

Motosuke Ohmi

Inventor
Tokyo, JP

Overview

8→
Patents
2004–2013
Patent span
Mechanical engineering
Primary field (CPC F)

Patents· 8 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits26%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact21%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application21%
G02BOptical elements, systems or apparatus16%
G06FElectric digital data processing5%
H10KOrganic electric solid-state devices5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2013Patents assigned to SONY CORP (8)· patent assignee history
2004–2013Based in Tokyo, JP· patent location history
2012–2013Patents assigned to OHMI MOTOSUKE (3)· patent assignee history
2012–2013Patents assigned to SUZUKI HIROMASA (3)· patent assignee history
2012–2013Patents assigned to YOKOMIZO KANJI (3)· patent assignee history
2013Patents assigned to KUWAYAMA TETSURO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SONY CORP82004–2013
OHMI MOTOSUKEself32012–2013
SUZUKI HIROMASA32012–2013
YOKOMIZO KANJI32012–2013
KUWAYAMA TETSURO12013
Locations
LocationPatentsSpan
Tokyo, JP82004–2013