Inventor

Uppili Sridhar

Inventor
Singapore, SG

Overview

36→
Patents
1990–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 36 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
B81BMicrostructural devices or systems, e.g. micromechanical devices8%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure7%
H01LSemiconductor devices7%
B01LChemical or physical laboratory apparatus for general use5%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%
H01FMagnets5%
H01HElectric switches5%
H03HImpedance networks, e.g. resonant circuits4%
PatentTitleYear
10,475,559Controlling the morphology in metal loaded paste material20199,331,048'Bonded stacked wafers and methods of electroplating bonded stacked wafers'20169,184,113'Methods of forming coaxial feedthroughs for 3D integrated circuits'20159,023,422'High rate deposition method of magnetic nanocomposites'20158,970,043'Bonded stacked wafers and methods of electroplating bonded stacked wafers'20158,952,768'Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filters'20158,940,631'Methods of forming coaxial feedthroughs for 3D integrated circuits'20158,686,543'3D chip package with shielded structures'20148,512,800'Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filters'20137,863,699'Bonded wafer package module'20117,463,125'Microrelays and microrelay fabrication and operating methods'20087,393,758'Wafer level packaging process'20086,908,825'Method of making an integrated circuit inductor wherein a plurality of apertures are formed beneath an inductive loop'20056,858,459'Method of fabricating micro-mirror switching device'20056,841,839'Microrelays and microrelay fabrication and operating methods'20056,765,300'Micro-relay'20046,762,049'Miniaturized multi-chamber thermal cycler for independent thermal multiplexing'20046,662,654'Z-axis accelerometer'20036,621,135'Microrelays and microrelay fabrication and operating methods'20036,571,628'Z-axis accelerometer'20036,573,154'High aspect ratio trench isolation process for surface micromachined sensors and actuators'20036,521,447'Miniaturized thermal cycler'20036,509,186'Miniaturized thermal cycler'20036,503,847'Room temperature wafer-to-wafer bonding by polydimethylsiloxane'20036,495,903'Integrated circuit inductor'20026,483,223'Method to prevent charging effects in electrostatic devices'20026,461,888'Lateral polysilicon beam process'20026,432,695'Miniaturized thermal cycler'20026,293,148'Structural design for improving the sensitivity of a surface-micromachined vibratory gyroscope'20016,263,740'CMOS compatible integrated pressure sensor'20016,122,975'CMOS compatible integrated pressure sensor'20005,930,595'Isolation process for surface micromachined sensors and actuators'19995,412,994'Offset pressure sensor'19955,360,521'Method for etching silicon'19945,119,166'Hall effect element aligned to reduce package-induced offsets'19924,952,904'Adhesion layer for platinum based sensors'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–1994Patents assigned to HONEYWELL INC (3)· patent assignee history
1990–1995Based in Garland, TX, US· patent location history
1999–2005Patents assigned to INST OF MICROELECTRONICS (17)· patent assignee history
1999–2008Based in Singapore, SG· patent location history
2003–2019Patents assigned to MAXIM INTEGRATED PRODUCTS (11)· patent assignee history
2011–2015Patents assigned to TRIQUINT SEMICONDUCTOR INC (3)· patent assignee history
2011–2016Based in Plano, TX, US· patent location history
2013–2015Patents assigned to SRIDHAR UPPILI (5)· patent assignee history
2014–2019Based in Cupertino, CA, US· patent location history
2015Based in Morgan Hill, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INST OF MICROELECTRONICS171999–2005
MAXIM INTEGRATED PRODUCTS112003–2019
SRIDHAR UPPILIself52013–2015
HONEYWELL INC31990–1994
TRIQUINT SEMICONDUCTOR INC32011–2015
Locations
LocationPatentsSpan
Singapore, SG201999–2008
Plano, Texas, US42011–2016
Morgan Hill, California, US42015
Garland, Texas, US41990–1995
Cupertino, California, US22014–2019