Inventor
Johann Glas
Inventor
Burghausen, DE
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Dprimary
B23DPlaning25%
B24BMachines, devices, or processes for grinding or polishing25%
B28DWorking stone or stone-like materials13%
C30BSingle-crystal growth13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y10TTechnical subjects covered by former us classification13%
PatentTitleYear
6,645,862'Double-side polishing process with reduced scratch rate and device for carrying out the process'20035,030,910'Method and apparatus for slicing crystalline wafers aided by magnetic field monitoring means'19914,844,047'Process for sawing crystal rods or blocks into thin wafers'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–1991Patents assigned to WACKER CHEMITRONIC (2)· patent assignee history
1989–2003Based in Burghausen, DE· patent location history
2003Patents assigned to WACKER SILTRONIC HALBLEITERMAT (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WACKER CHEMITRONIC | 2 | 1989–1991 |
| WACKER SILTRONIC HALBLEITERMAT | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Burghausen, DE | 3 | 1989–2003 |