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Inventor

Jun Hisada

Inventor
Amagasaki, JP

Overview

3→
Patents
2004–2007
Patent span
Chemistry
Primary field (CPC C)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material19%
H05KPrinted circuits19%
Y10TTechnical subjects covered by former us classification19%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form13%
A62CFire-fighting6%
B42DBooks6%
C23FNon-mechanical removal of metallic material from surface6%
G09BEducational or demonstration appliances6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
PatentTitleYear
7,156,904'Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby'20077,029,761'Bonding layer for bonding resin on copper surface'20066,733,886'Laminate and method of manufacturing the same'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2007Patents assigned to MEC CO LTD (3)· patent assignee history
2004–2007Based in Amagasaki, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MEC CO LTD32004–2007
Locations
LocationPatentsSpan
Amagasaki, JP32004–2007