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Inventor

Shinichi Tomizawa

Inventor
Annaka, JP

Overview

3→
Patents
2004–2009
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10DInorganic electric semiconductor devices22%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
PatentTitleYear
7,531,425'Method of fabricating bonded wafer'20096,884,696'Method for producing bonding wafer'20056,797,632'Bonded wafer producing method and bonded wafer'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2009Patents assigned to SHINETSU HANDOTAI KK (3)· patent assignee history
2004–2009Based in Annaka, JP· patent location history
2005Based in Gunma, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SHINETSU HANDOTAI KK32004–2009
Locations
LocationPatentsSpan
Annaka, JP22004–2009
Gunma, JP12005