Inventor
Xavier Baraton
Inventor
Moirans, FR
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
9,455,241'Integrated circuit package and method of forming the same'20169,012,269'Reducing warpage for fan-out wafer level packaging'20157,247,928'Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007Patents assigned to ST MICROELECTRONICS SA (1)· patent assignee history
2007–2016Based in Moirans, FR· patent location history
2015–2016Patents assigned to ST MICROELECTRONICS PTE LTD (2)· patent assignee history
2015Patents assigned to BARATON XAVIER (1)· patent assignee history
2015Patents assigned to CHE FAXING (1)· patent assignee history
2015Patents assigned to JIN YONGGANG (1)· patent assignee history
2015Based in Singapore, SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST MICROELECTRONICS PTE LTD | 2 | 2015–2016 |
| BARATON XAVIERself | 1 | 2015 |
| CHE FAXING | 1 | 2015 |
| JIN YONGGANG | 1 | 2015 |
| ST MICROELECTRONICS SA | 1 | 2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Moirans, FR | 2 | 2007–2016 |
| Singapore, SG | 1 | 2015 |