Inventor
David V. Pedersen
Inventor
Scotts Valley, CA, US
Overview
Patents· 53 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
G01RMeasuring electric variables19%
H05KPrinted circuits15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y02PClimate change mitigation technologies in the production or processing of goods7%
H01RElectrically-conductive connections6%
Y10TTechnical subjects covered by former us classification6%
H10DInorganic electric semiconductor devices5%
B23KSoldering or unsoldering5%
C25DProcesses for the electrolytic or electrophoretic production of coatings2%
PatentTitleYear
10,079,942Methods and apparatus for implementing telemetry applications on a subscriber identity module20188,011,089'Method of repairing segmented contactor'20117,714,235'Lithographically defined microelectronic contact structures'20107,688,090'Wafer-level burn-in and test'20107,579,269'Microelectronic spring contact elements'20097,578,057'Method of fabricating segmented contactor'20097,557,596'Test assembly including a test die for testing a semiconductor product die'20097,534,654'Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component'20097,345,493'Wafer-level burn-in and test'20087,217,580'Method for processing an integrated circuit'20077,215,131'Segmented contactor'20077,202,677'Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component'20077,078,926'Wafer-level burn-in and test'20067,065,870'Segmented contactor'20067,059,047'Sockets for “springed†semiconductor devices'20066,940,093'Special contact points for accessing internal circuitry of an integrated circuit'20056,825,052'Test assembly including a test die for testing a semiconductor product die'20046,788,094'Wafer-level burn-in and test'20046,766,348'Method and system for load-balanced data exchange in distributed network-based resource allocation'20046,727,580'Microelectronic spring contact elements'20046,690,185'Large contactor with multiple, aligned contactor units'20046,665,701'Method and system for contention controlled data exchange in a distributed network-based resource allocation'20036,664,628'Electronic component overlapping dice of unsingulated semiconductor wafer'20036,644,982'Method and apparatus for the transport and tracking of an electronic component'20036,640,415'Segmented contactor'20036,627,483'Method for mounting an electronic component'20036,621,260'Special contact points for accessing internal circuitry of an integrated circuit'20036,603,324'Special contact points for accessing internal circuitry of an integrated circuit'20036,597,187'Special contact points for accessing internal circuitry of an integrated circuit'20036,551,844'Test assembly including a test die for testing a semiconductor product die'20036,534,856'Sockets for springed semiconductor devices'20036,525,555'Wafer-level burn-in and test'20036,523,065'Method and system for maintenance of global network information in a distributed network-based resource allocation system'20036,486,528'Silicon segment programming apparatus and three terminal fuse configuration'20026,456,099'Special contact points for accessing internal circuitry of an integrated circuit'20026,429,029'Concurrent design and subsequent partitioning of product and test die'20026,330,164'Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device'20016,232,149'Sockets for \"springed\" semiconductor devices'20016,215,196'Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals'20016,188,126'Vertical interconnect process for silicon segments'20016,184,053'Method of making microelectronic spring contact elements'20016,134,118'Conductive epoxy flip-chip package and method'20006,064,213'Wafer-level burn-in and test'20006,043,563'Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals'20006,033,935'Sockets for \"springed\" semiconductor devices'20005,998,864'Stacking semiconductor devices, particularly memory chips'19995,994,170'Silicon segment programming method'19995,936,302'Speaker diaphragm'19995,837,566'Vertical interconnect process for silicon segments'19985,698,895'Silicon segment programming method and apparatus'19975,675,180'Vertical interconnect process for silicon segments'19975,661,087'Vertical interconnect process for silicon segments'19975,657,206'Conductive epoxy flip-chip package and method'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2001Patents assigned to CUBIC MEMORY INC (9)· patent assignee history
1997–2018Based in Scotts Valley, CA, US· patent location history
1999–2011Patents assigned to FORMFACTOR INC (39)· patent assignee history
2003–2004Patents assigned to WORLDCOM INC (3)· patent assignee history
2003–2004Based in Monument, CO, US· patent location history
2018Patents assigned to AERIS COMMUNICATIONS INC (1)· patent assignee history
2018Patents assigned to HO HEIN DINH (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FORMFACTOR INC | 39 | 1999–2011 |
| CUBIC MEMORY INC | 9 | 1997–2001 |
| WORLDCOM INC | 3 | 2003–2004 |
| AERIS COMMUNICATIONS INC | 1 | 2018 |
| HO HEIN DINH | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Scotts Valley, California, US | 50 | 1997–2018 |
| Monument, CO, US | 3 | 2003–2004 |