Inventor

Dean Fernando

Inventor
Torrance, CA, US

Overview

17→
Patents
2013–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1049%
H01LSemiconductor devices43%
H02HEmergency protective circuit arrangements3%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
10,438,876Power quad flat no-lead (PQFN) package in a single shunt inverter circuit20199,899,302'Semiconductor package having multi-phase power inverter with internal temperature sensor'20189,711,437'Semiconductor package having multi-phase power inverter with internal temperature sensor'20179,659,845'Power quad flat no-lead (PQFN) package in a single shunt inverter circuit'20179,620,954'Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values'20179,530,724'Compact power quad flat no-lead (PQFN) package'20169,524,928'Power quad flat no-lead (PQFN) package having control and driver circuits'20169,449,957'Control and driver circuits on a power quad flat no-lead (PQFN) leadframe'20169,443,795'Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)'20169,362,215'Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter'20169,355,995'Semiconductor packages utilizing leadframe panels with grooves in connecting bars'20169,324,646'Open source power quad flat no-lead (PQFN) package'20169,324,638'Compact wirebonded power quad flat no-lead (PQFN) package'20169,041,175'Monolithic power converter package'20159,024,420'Power quad flat no-lead (PQFN) package'20158,901,742'Monolithic Power Converter Package with Through Substrate vias'20148,587,101'Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2016Patents assigned to INT RECTIFIER CORP (7)· patent assignee history
2013–2016Patents assigned to BARBOSA ROEL (2)· patent assignee history
2013–2016Patents assigned to FERNANDO DEAN (2)· patent assignee history
2013–2019Based in Torrance, CA, US· patent location history
2016–2019Patents assigned to INFINEON TECHNOLOGIES AMERICAS CORP (12)· patent assignee history
2016Patents assigned to INFINEON TECHNOLOGIES AMERICA CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AMERICAS CORP122016–2019
INT RECTIFIER CORP72013–2016
BARBOSA ROEL22013–2016
FERNANDO DEANself22013–2016
INFINEON TECHNOLOGIES AMERICA CORP12016
Locations
LocationPatentsSpan
Torrance, California, US172013–2019