Inventor
Hongwen Yang
Inventor
Shanghai, CN
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections38%
H05KPrinted circuits19%
H01LSemiconductor devices10%
H03MCoding10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
G02BOptical elements, systems or apparatus5%
G06FElectric digital data processing5%
H04LTransmission of digital information, e.g. telegraphic communication5%
PatentTitleYear
10,861,772Clamping mechanism for heat sink and electronic device assembly including the same202010,177,474Connector and connector assembly20199,980,411Connector, connector assembly and apparatus20189,788,468'Cage assembly for electrical devices'20179,716,336'Cage of electronic apparatus'20179,601,877'Connector housing'20179,590,365'Connector housing'20179,583,888'Connector housing'20178,568,171'Stacked electrical connector'20137,900,126'Systems and methods for reduced complexity LDPC decoding'20117,895,500'Systems and methods for reduced complexity LDPC decoding'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011Patents assigned to VIA TELECOM CO LTD (1)· patent assignee history
2011Patents assigned to VIA TELECOM INC (1)· patent assignee history
2011Based in Beijing, CN· patent location history
2013–2020Patents assigned to TYCO ELECTRONICS SHANGHAI CO LTD (9)· patent assignee history
2013Patents assigned to LI HUIBIN (1)· patent assignee history
2013Patents assigned to YANG HONGWEN (1)· patent assignee history
2013–2020Based in Shanghai, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TYCO ELECTRONICS SHANGHAI CO LTD | 9 | 2013–2020 |
| LI HUIBIN | 1 | 2013 |
| VIA TELECOM CO LTD | 1 | 2011 |
| VIA TELECOM INC | 1 | 2011 |
| YANG HONGWENself | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shanghai, CN | 9 | 2013–2020 |
| Beijing, CN | 2 | 2011 |