Inventor
PING PING OOI
Inventor
MY
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H05KPrinted circuits20%
PatentTitleYear
12,142,570Composite bridge die-to-die interconnects for integrated-circuit packages202412,002,793Integrating system in package (SiP) with input/output (IO) board for platform miniaturization202411,837,458Substrate with gradiated dielectric for reducing impedance mismatch202311,521,932Composite bridge die-to-die interconnects for integrated-circuit packages202211,355,458Interconnect core202211,164,827Substrate with gradiated dielectric for reducing impedance mismatch2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to INTEL CORP (6)· patent assignee history
2021–2024Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 6 | 2021–2024 |