Inventor
Mark D. Frank
Inventor
Longmont, CO, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing54%
H05KPrinted circuits23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
F41HArmour3%
F42BExplosive charges, e.g. for blasting, fireworks, ammunition3%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes3%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%
Y04SSystems integrating technologies related to power network operation, communication or information technologies for improving the electrical power generation, transmission, distribution, management or usage, i.e. smart grids3%
PatentTitleYear
8,037,797'Method for breaching a minefield'20117,326,860'Routing vias in a substrate from bypass capacitor pads'20087,327,583'Routing power and ground vias in a substrate'20087,272,806'System and method for evaluating power and ground vias in a package design'20077,143,389'Systems and methods for generating node level bypass capacitor models'20067,143,022'System and method for integrating subcircuit models in an integrated power grid analysis environment'20067,137,088'System and method for determining signal coupling coefficients for lines'20067,117,464'System and method for evaluating signal coupling between differential traces in a package design'20067,078,812'Routing differential signal lines in a substrate'20067,075,185'Routing vias in a substrate from bypass capacitor pads'20067,069,095'System and method for populating a computer-aided design program\'s database with design parameters'20067,055,124'System and method for evaluating signal deviations in a package design'20066,983,434'Differential via pair impedance adjustment tool'20066,983,433'Differential line pair impedance adjustment tool'20066,976,233'Signal via impedance verification tool'20056,971,077'Signal line impedance adjustment tool'20056,968,522'Differential line pair impedance verification tool'20056,938,230'System and method for evaluating signal trace discontinuities in a package design'20056,922,822'Verifying proximity of ground vias to signal vias in an integrated circuit'20056,907,589'System and method for evaluating vias per pad in a package design'20056,889,367'Differential via pair impedance verification tool'20056,859,915'Signal line impedance verification tool'20056,845,492'Signal via impedance adjustment tool'20056,807,657'Inter-signal proximity verification in an integrated circuit'20046,769,102'Verifying proximity of ground metal to signal traces in an integrated circuit'20046,711,730'Synthesizing signal net information from multiple integrated circuit package models'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2008Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (25)· patent assignee history
2004–2008Based in Longmont, CO, US· patent location history
2011Patents assigned to BAE SYS INF & ELECT SYS INTEG (1)· patent assignee history
2011Based in Austin, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD DEVELOPMENT CO | 25 | 2004–2008 |
| BAE SYS INF & ELECT SYS INTEG | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Longmont, CO, US | 25 | 2004–2008 |
| Austin, Texas, US | 1 | 2011 |