Inventor
CHEN-CHENG KUO
Inventor
TW
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
PatentTitleYear
12,218,001Semiconductor package and method of fabricating semiconductor package202512,125,741Semiconductor package and method of fabricating semiconductor package202412,113,055Stress reduction apparatus and method202412,094,728Semiconductor device202411,961,791Package structures and methods for forming the same202411,862,512Semiconductor package and method of fabricating semiconductor package202411,855,025Semiconductor device and package assembly including the same202311,756,929Semiconductor packages202311,699,598Semiconductor device202311,342,253Package structures and methods for forming the same202211,322,479Semiconductor packages and manufacturing methods thereof202211,244,940Stress reduction apparatus and method2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (12)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 12 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 12 | 2022–2025 |