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Inventor

Qingyun ZHOU

Inventor
CN

Overview

2→
Patents
2022–2023
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
11,823,911Process of package-then-etch three-dimensional package structure electrically connected by plated copper pillars202311,217,459Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereof2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD (2)· patent assignee history
2022–2023Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD22022–2023
Locations
LocationPatentsSpan
CN22022–2023