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Inventor

Hiroshi Maki

Inventor
Tokyo, JP

Overview

52→
Patents
1977–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 52 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
Y10TTechnical subjects covered by former us classification10%
C07CAcyclic or carbocyclic compounds5%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
G02BOptical elements, systems or apparatus4%
H10DInorganic electric semiconductor devices4%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
H01LSemiconductor devices4%
H04NPictorial communication, e.g. television4%
PatentTitleYear
11,059,401Seat back202110,158,087Organic thin film, and organic semiconductor device and organic transistor using same201810,096,526Die bonder and bonding method20189,951,275Liquid Crystal Display Device20189,810,938'Liquid crystal display device'20179,464,231'Liquid crystal display device'20169,436,032'Liquid crystal display device'20169,318,361'Collet cleaning method and die bonder using the same'20168,991,681'Die bonder and bonding method'20158,783,319'Foreign substance removing device and die bonder equipped with the same'20148,727,202'Die bonder and bonding method'20148,703,583'Fabrication method of semiconductor device'20148,640,943'Fabrication method of semiconductor integrated circuit device'20148,593,261'Tool management method of die bonder and die bonder'20138,574,933'Fabrication method of semiconductor device'20138,561,664'Die bonder, pickup method, and pickup device'20138,492,173'Manufacturing method for semiconductor integrated device'20138,450,150'Manufacturing method of semiconductor integrated circuit device'20138,372,665'Manufacturing method for semiconductor integrated device'20138,367,433'Fabrication method of semiconductor device'20138,292,159'Fabrication method of semiconductor integrated circuit device'20128,222,050'Manufacturing method for semiconductor integrated device'20128,211,261'Semiconductor manufacturing method of die pick-up from wafer'20128,074,868'Fabrication method of semiconductor integrated circuit device'20118,003,495'Manufacturing method for semiconductor integrated device'20117,888,141'Manufacturing method for semiconductor integrated device'20117,861,912'Fabrication method of semiconductor integrated circuit device'20117,824,932'Fabrication method of semiconductor device'20107,759,164'Semiconductor manufacturing method of die pick-up from wafer'20107,757,930'Fabrication method of semiconductor integrated circuit device'20107,629,231'Fabrication method of semiconductor device'20097,498,241'Semiconductor manufacturing method of die pick-up from wafer'20097,270,258'Method of fabrication of semiconductor integrated circuit device'20077,115,482'Method of manufacturing semiconductor device'20067,015,071'Method of manufacturing a semiconductor device'20066,844,979'Projection display apparatus'20056,609,796'Projection type display apparatus'20036,345,895'Projection type display apparatus'20026,291,738'Outfit supporting member and outfit made by using the same'20016,010,221'Projection type display apparatus'20005,884,199'Portable wireless receiver'19995,512,821'Method and apparatus for magnetically detecting defects in an object with compensation for magnetic field shift by means of a compensating coil'19965,276,193'Process for preparing N-alkyl-substituted aminophenols'19945,202,485'Process for preparing N-alkylaminophenols'19934,967,004'Process for producing N,N-diethylaminophenols'19904,787,973'Device for converting water into mineral water'19884,585,896'Process for the production of an aminophenol'19864,486,605'Method for producing aromatic carbonyl compounds'19844,308,406'Method for preventing the discoloration of dihydric phenols'19814,075,285'Rubber-modified polystyrene resin composition'19784,073,831'Thermoplastic resin composition'19784,017,436'Thermoplastic resin composition'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–1994Patents assigned to SUMITOMO CHEMICAL CO (9)· patent assignee history
1984–1994Based in Chiba, JP· patent location history
1988–2018Patents assigned to MAKI HIROSHI (16)· patent assignee history
1996–2016Based in Tokyo, JP· patent location history
2006–2012Patents assigned to RENESAS E JP SEMICONDUCTOR INC (6)· patent assignee history
2006–2014Based in Ryuou, JP· patent location history
2010–2014Patents assigned to RENESAS ELECTRONICS CORP (14)· patent assignee history
2013–2018Based in Kumagaya, JP· patent location history
2016–2018Patents assigned to DAINIPPON INK & CHEMICALS (5)· patent assignee history
2016–2018Based in Sakura, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MAKI HIROSHIself161988–2018
RENESAS ELECTRONICS CORP142010–2014
SUMITOMO CHEMICAL CO91977–1994
RENESAS E JP SEMICONDUCTOR INC62006–2012
DAINIPPON INK & CHEMICALS52016–2018
Locations
LocationPatentsSpan
Tokyo, JP131996–2016
Ryuou, JP82006–2014
Kumagaya, JP62013–2018
Sakura, JP52016–2018
Chiba, JP51984–1994