Inventor

Mark V. Pierson

Inventor

Binghamton, NY, US

Overview

106→

Patents

1977–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 106 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%

H05KPrinted circuits21%

Y10TTechnical subjects covered by former us classification13%

B23KSoldering or unsoldering8%

Y02PClimate change mitigation technologies in the production or processing of goods6%

G01RMeasuring electric variables4%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

B29CShaping or joining of plastics2%

G02BOptical elements, systems or apparatus1%

PatentTitleYear

11,083,316Recyclable and dispensable cutlery utensil2021 10,820,722No touch utensil dispenser2020 9,211,558'Toothpaste dispenser'2015 8,272,533'No touch utensil dispenser'2012 8,089,133'Optical assemblies for transmitting and manipulating optical beams'2012 7,718,902'Z interconnect structure and method'2010 7,335,325'Formable structure between two objects'2008 6,980,392'System and method for capturing contaminants within a disk drive'2005 6,955,982'Flip chip C4 extension structure and process'2005 6,946,329'Methods of making and using a floating interposer'2005 6,922,294'Optical communication assembly'2005 6,917,728'Fiber optic attachment method, structure, and system'2005 6,836,015'Optical assemblies for transmitting and manipulating optical beams'2004 6,805,280'Z interconnect structure and method'2004 6,774,315'Floating interposer'2004 6,774,472'Panel structure with plurality of chip compartments for providing high volume of chip modules'2004 6,770,968'Method for bonding heat sinks to overmolds and device formed thereby'2004 6,759,738'Systems interconnected by bumps of joining material'2004 6,756,680'Flip chip C4 extension structure and process'2004 6,719,871'Method for bonding heat sinks to overmolds and device formed thereby'2004 6,708,871'Method for forming solder connections on a circuitized substrate'2004 6,699,736'Electrical coupling of a stiffener to a chip carrier'2004 6,674,647'Low or no-force bump flattening structure and method'2004 6,664,637'Flip chip C4 extension structure and process'2003 6,661,661'Common heatsink for multiple chips and modules'2003 6,639,638'LCD cover optical structure and method'2003 6,576,996'Method for bonding heat sinks to overmolds and device formed thereby'2003 6,569,710'Panel structure with plurality of chip compartments for providing high volume of chip modules'2003 6,559,666'Method and device for semiconductor testing using electrically conductive adhesives'2003 6,534,848'Electrical coupling of a stiffener to a chip carrier'2003 6,517,662'Process for making semiconductor chip assembly'2003 6,516,513'Method of making a CTE compensated chip interposer'2003 6,513,701'Method of making electrically conductive contacts on substrates'2003 6,497,943'Surface metal balancing to reduce chip carrier flexing'2002 6,492,071'Wafer scale encapsulation for integrated flip chip and surface mount technology assembly'2002 6,492,724'Structure for reinforcing a semiconductor device to prevent cracking'2002 6,487,461'TFT panel alignment and attachment method and apparatus'2002 6,437,254'Apparatus and method for printed circuit board repair'2002 6,429,384'Chip C4 assembly improvement using magnetic force and adhesive'2002 6,399,892'CTE compensated chip interposer'2002 6,358,627'Rolling ball connector'2002 6,344,099'TFT panel alignment and attachment method and apparatus'2002 6,295,724'Apparatus for printed circuit board repair'2001 6,288,559'Semiconductor testing using electrically conductive adhesives'2001 6,268,739'Method and device for semiconductor testing using electrically conductive adhesives'2001 6,255,208'Selective wafer-level testing and burn-in'2001 6,252,779'Ball grid array via structure'2001 6,225,206'Flip chip C4 extension structure and process'2001 6,206,997'Method for bonding heat sinks to overmolds and device formed thereby'2001 6,197,619'Method for reinforcing a semiconductor device to prevent cracking'2001 6,193,576'TFT panel alignment and attachment method and apparatus'2001 6,187,610'Flexible thin film ball grid array containing solder mask'2001 6,179,196'Apparatus for manufacturing circuit boards'2001 6,177,729'Rolling ball connector'2001 6,173,887'Method of making electrically conductive contacts on substrates'2001 6,165,885'Method of making components with solder balls'2000 6,156,165'Method of forming a metallization feature on an edge of an IC chip'2000 6,150,726'Component carrier with raised bonding sites'2000 6,142,361'Chip C4 assembly improvement using magnetic force and adhesive'2000 6,129,804'TFT panel alignment and attachment method and apparatus'2000 6,115,912'Apparatus and method for printed circuit board repair'2000 6,100,114'Encapsulation of solder bumps and solder connections'2000 6,068,175'System for replacing a first area array component connected to an interconnect board'2000 6,059,939'Method for high density edge mounting of chips'2000 6,027,006'Method and apparatus for applying solder and forming solder balls on a substrate'2000 6,018,866'Apparatus and method for printed circuit board repair'2000 5,980,348'TFT panel alignment and attachment method and apparatus'1999 5,973,389'Semiconductor chip carrier assembly'1999 5,969,945'Electronic package assembly'1999 5,938,106'Method and apparatus for applying solder and forming solder balls on a substrate'1999 5,903,437'High density edge mounting of chips'1999 5,889,654'Advanced chip packaging structure for memory card applications'1999 5,889,321'Stiffeners with improved adhesion to flexible substrates'1999 5,875,010'Display panel having individual display devices bonded to light transmitting plates which have a combined area greater than of the devices'1999 5,875,011'Liquid crystal display tile interconnected to a tile carrier and method'1999 5,872,051'Process for transferring material to semiconductor chip conductive pads using a transfer substrate'1999 5,862,588'Method for restraining circuit board warp during area array rework'1999 5,831,828'Flexible circuit board and common heat spreader assembly'1998 5,818,107'Chip stacking by edge metallization'1998 5,818,697'Flexible thin film ball grid array containing solder mask'1998 5,809,641'Method for printed circuit board repair'1998 5,808,710'Liquid crystal display tile interconnect structure'1998 5,796,452'Simplified wiring escape technique for tiled display'1998 5,777,705'Wire bond attachment of a liquid crystal display tile to a tile carrier'1998 5,759,269'Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture'1998 5,759,737'Method of making a component carrier'1998 5,672,980'Method and apparatus for testing integrated circuit chips'1997 5,659,256'Method and apparatus for testing integrated circuit chips'1997 5,638,597'Manufacturing flexible circuit board assemblies with common heat spreaders'1997 5,565,033'Pressurized injection nozzle for screening paste'1996 5,545,465'Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits'1996 5,528,159'Method and apparatus for testing integrated circuit chips'1996 5,523,696'Method and apparatus for testing integrated circuit chips'1996 5,478,700'Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head'1995 5,451,131'Dockable interface airlock between process enclosure and interprocess transfer container'1995 5,420,520'Method and apparatus for testing of integrated circuit chips'1995 5,395,198'Vacuum loading chuck and fixture for flexible printed circuit panels'1995 5,364,225'Method of printed circuit panel manufacture'1994 5,339,952'Transfer container for transferring flimsy circuit panels under clean room conditions'1994 5,315,227'Solar recharge station for electric vehicles'1994 5,290,992'Apparatus for maximizing light beam utilization'1994 4,813,130'Automatic extrusion pinning method and apparatus'1989 4,741,100'Pin retention method and apparatus'1988 4,422,232'Electronic component insertion machine'1983 4,273,393'Automatic component dispensor'1981 4,030,180'Longitudinally fed component insertion apparatus'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–2021Patents assigned to PIERSON MARK V (6)· patent assignee history

1977–2021Based in Binghamton, NY, US· patent location history

1981–1983Patents assigned to USM CORP (2)· patent assignee history

1981Based in Lynn, MA, US· patent location history

1988–2012Patents assigned to IBM (96)· patent assignee history

1999–2004Based in Binghampton, NY, US· patent location history

1999–2003Based in Broome, NY, US· patent location history

2000Based in Vestal, NY, US· patent location history

2012Patents assigned to D AMELIA ANTHONY (1)· patent assignee history

2020–2021Patents assigned to WADDINGTON NORTH AMERICA INC (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	96	1988–2012
PIERSON MARK Vself	6	1977–2021
USM CORP	2	1981–1983
WADDINGTON NORTH AMERICA INC	2	2020–2021
D AMELIA ANTHONY	1	2012

Locations

Location	Patents	Span
Binghamton, New York, US	100	1977–2021
Binghampton, New York, US	2	1999–2004
Broome, New York, US	2	1999–2003
Vestal, New York, US	1	2000
Lynn, Massachusetts, US	1	1981