Inventor

Richard F. Frankeny

Inventor

Austin, TX, US

Overview

44→

Patents

1981–2003

Patent span

Electricity

Primary field (CPC H)

Patents· 44 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%

H05KPrinted circuits18%

Y10TTechnical subjects covered by former us classification8%

G06FElectric digital data processing7%

H01RElectrically-conductive connections7%

H03KPulse technique7%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

H04LTransmission of digital information, e.g. telegraphic communication4%

G01RMeasuring electric variables3%

G11BInformation storage based on relative movement between record carrier and transducer3%

PatentTitleYear

6,522,613'Combination media and media playstation storage unit'2003 6,419,082'Media storage unit with expandable and separable pockets'2002 6,262,565'Electrical load switch'2001 6,098,282'Laminar stackable circuit board structure with capacitor'2000 6,101,561'System for providing an increase in digital data transmission rate over a parallel bus by converting binary format voltages to encoded analog format currents'2000 5,949,982'Data processing system and method for implementing a switch protocol in a communication system'1999 5,923,276'Current source based multilevel bus driver and converter'1999 5,913,075'High speed communication between high cycle rate electronic devices using a low cycle rate bus'1999 5,815,107'Current source referenced high speed analog to digitial converter'1998 5,793,223'Reference signal generation in a switched current source transmission line driver/receiver system'1998 5,790,380'Method for fabricating a multiple chip module using orthogonal reorientation of connection planes'1998 5,785,399'Bilateral media storage unit'1998 5,770,891'Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer'1998 5,760,601'Transmission line driver circuit for matching transmission line characteristic impedance'1998 5,745,333'Laminar stackable circuit board structure with capacitor'1998 5,712,583'Clock phase alignment using frequency comparison'1998 5,691,041'Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer'1997 5,680,342'Memory module package with address bus buffering'1997 5,638,019'Accurately generating precisely skewed clock signals'1997 5,578,939'Bidirectional transmission line driver/receiver'1996 5,568,064'Bidirectional transmission line driver/receiver'1996 5,509,200'Method of making laminar stackable circuit board structure'1996 5,363,275'Modular component computer system'1994 5,316,787'Method for manufacturing electrically isolated polyimide coated vias in a flexible substrate'1994 5,313,097'High density memory module'1994 5,290,710'Method for testing integrated circuits on a carrier substrate'1994 5,279,711'Chip attach and sealing method'1994 5,229,916'Chip edge interconnect overlay element'1993 5,222,668'Fluid actuated connector'1993 5,222,012'Power management circuit for a magnetic repulsion punch'1993 5,205,740'Super connector for connecting flat ribbon cables'1993 5,161,087'Pivotal heat sink assembly'1992 5,148,003'Modular test oven'1992 5,146,674'Manufacturing process of a high density substrate design'1992 5,121,299'Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein'1992 5,065,227'Integrated circuit packaging using flexible substrate'1991 5,053,853'Modular electronic packaging system'1991 5,037,311'High density interconnect strip'1991 5,006,924'Heat sink for utilization with high density integrated circuit substrates'1991 4,975,637'Method and apparatus for integrated circuit device testing'1990 4,943,242'Zero insertion force high density connector system'1990 4,903,113'Enhanced tab package'1990 4,453,194'Integrated power circuit with current sensing means'1984 4,286,202'Electronic damping of stepper motor'1981

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1981–2000Patents assigned to IBM (39)· patent assignee history

1981–1999Based in Elgin, TX, US· patent location history

1991–2003Based in Austin, TX, US· patent location history

1998Based in Elein, TX, US· patent location history

2000Based in Cedar Park, TX, US· patent location history

2001Patents assigned to MYTECH CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	39	1981–2000
MYTECH CORP	1	2001

Locations

Location	Patents	Span
Austin, Texas, US	22	1991–2003
Elgin, Texas, US	20	1981–1999
Cedar Park, Texas, US	1	2000
Elein, Texas, US	1	1998