Inventor
YI-LI HSIAO
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B23KSoldering or unsoldering10%
H01JElectric discharge tubes or discharge lamps10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10DInorganic electric semiconductor devices5%
PatentTitleYear
12,463,175Bonding with pre-deoxide process and apparatus for performing the same202512,027,446Method for forming a semiconductor component with a cooling structure202411,955,378Bonding method of package components and bonding apparatus202411,515,233Semiconductor component with cooling structure202211,443,981Bonding method of package components and bonding apparatus202211,348,889Semiconductor device and bump formation process202211,342,302Bonding with pre-deoxide process and apparatus for performing the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2025 |