Inventor
Sheng-Feng Lu
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H04NPictorial communication, e.g. television11%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%
Y10TTechnical subjects covered by former us classification11%
H01LSemiconductor devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
9,601,424'Interposer and methods of forming and testing an interposer'20177,915,903'Batch-test method using a chip tray'20117,595,631'Wafer level assemble chip multi-site testing solution'20097,589,033'Fabrication of wafer-level test module for testing image sensor chips'20097,576,551'Test socket and test board for wafer level semiconductor testing'20097,414,423'Wafer-level test module for testing image sensor chips, the related test method and fabrication'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2011Patents assigned to VISERA TECHNOLOGIES CO LTD (5)· patent assignee history
2008–2011Based in Hsinchu, TW· patent location history
2017Patents assigned to GLOBALFOUNDRIES INC (1)· patent assignee history
2017Based in Baoshan Township, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| VISERA TECHNOLOGIES CO LTD | 5 | 2008–2011 |
| GLOBALFOUNDRIES INC | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 2008–2011 |
| Baoshan Township, TW | 1 | 2017 |