Inventor
Sung-kwan Paek
Inventor
Changwon-si, KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H01LSemiconductor devices18%
Y10TTechnical subjects covered by former us classification18%
A47JKitchen equipment9%
C22CAlloys9%
PatentTitleYear
9,142,495'Lead frame and semiconductor package manufactured by using the same'20158,937,378'Lead frame and semiconductor package including the same'20158,319,340'Lead frame and method of manufacturing the same'20127,268,021'Lead frame and method of manufacturing the same'20077,250,671'Lead frame and method for manufacturing semiconductor package with the same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2012Patents assigned to SAMSUNG TECHWIN CO LTD (3)· patent assignee history
2007–2015Based in Changwon-si, KR· patent location history
2012–2015Patents assigned to PAEK SUNG-KWAN (2)· patent assignee history
2015Patents assigned to MDS CO LTD (2)· patent assignee history
2015Patents assigned to HAESUNG DS CO LTD (1)· patent assignee history
2015Patents assigned to PARK SE-CHUEL (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG TECHWIN CO LTD | 3 | 2007–2012 |
| MDS CO LTD | 2 | 2015 |
| PAEK SUNG-KWANself | 2 | 2012–2015 |
| HAESUNG DS CO LTD | 1 | 2015 |
| PARK SE-CHUEL | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Changwon-si, KR | 5 | 2007–2015 |