Inventor
Masashi Miyazaki
Inventor
Tokyo, JP
Overview
Patents· 52 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01LSemiconductor devices10%
Y10TTechnical subjects covered by former us classification8%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H04NPictorial communication, e.g. television5%
G01RMeasuring electric variables4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters2%
PatentTitleYear
11,069,589Circuit board and circuit module202111,056,984Inverter control device202110,840,845Vehicle drive control device202010,785,876Intermediate printed board for making multiple printed circuit boards and method of manufacturing the same202010,742,855Circuit board and circuit module202010,674,601Printed wiring board and camera module202010,607,940Semiconductor module202010,602,608Circuit board202010,499,494Circuit board201910,204,733Module substrate201910,050,014Circuit substrate and method of manufacturing same201810,043,726Embedded component substrate with a metal core layer having an open cavity and pad electrodes at the bottom of the cavity201810,021,791Multilayer wiring substrate20189,998,052Rotary electric machine control device20189,859,632'Composite substrate and rigid substrate'20189,818,780'Camera module'20179,484,372'Substrate for embedding imaging device and method for manufacturing same, and imaging apparatus'20169,363,897'Substrate with built-in electronic component'20169,317,199'Setting a display position of a pointer'20169,301,407'Method of manufacturing substrate having cavity'20169,253,386'Camera module'20169,078,370'Substrate with built-in electronic component'20158,988,885'Electronic circuit module and method for producing the same'20158,963,016'Printed wiring board and method for manufacturing same'20158,959,400'System, program, and method for collecting errors which occur while a user uses a computer'2015RE045146'Composite multi-layer substrate and module using the substrate'20148,811,021'Electronic circuit module'20148,791,783'Electronic component to be embedded in substrate and component-embedded substrate'20148,774,205'Network device and its control method and computer program product'20148,320,447'Encoding apparatus and encoding method, and decoding apparatus and decoding method'20128,314,343'Multi-layer board incorporating electronic component and method for producing the same'20128,189,674'Decoding method, program for decoding method, recording medium with recorded program for decoding method, and decoding device'20128,119,451'Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package'20128,060,326'Measuring apparatus, measuring method and test apparatus'20117,999,577'Apparatus and method for detecting a changing point of measured signal'20117,928,560'Composite multi-layer substrate and module using the substrate'20117,745,926'Composite multi-layer substrate and module using the substrate'20107,738,256'Multilayer substrate including components therein'20107,379,306'Multilayer substrate including components therein'20087,348,662'Composite multi-layer substrate and module using the substrate'20087,278,205'Multilayer printed wiring board and production method therefor'20077,275,197'Testing apparatus'20077,237,167'Testing apparatus'20077,096,139'Testing apparatus'20066,306,481'Multilayer circuit board having insulating layer with via-holes'20016,190,834'Photosensitive resin composition, and multilayer printed circuit board using the same'20015,919,603'Process for producing printed wiring board'19995,914,216'Multilayer circuit board and photosensitive resin composition used therefor'19995,712,080'Method for manufacturing printed circuit board'19985,438,751'Process for producing printed wiring board'19955,294,291'Process for the formation of a conductive circuit pattern'19944,885,873'Abrading apparatus for spherically shaping workpieces'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2021Based in Tokyo, JP· patent location history
1994–2001Patents assigned to HITACHI LTD (7)· patent assignee history
1994–2001Based in Hadano, JP· patent location history
1998–2001Patents assigned to HITACHI CHEMICAL CO LTD (4)· patent assignee history
2006–2011Patents assigned to ADVANTEST CORP (5)· patent assignee history
2007–2021Patents assigned to TAIYO YUDEN KK (30)· patent assignee history
2008–2014Based in Gunma, JP· patent location history
2008–2015Based in Takasaki, JP· patent location history
2011–2015Patents assigned to MIYAZAKI MASASHI (10)· patent assignee history
2018–2021Based in Anjo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIYO YUDEN KK | 30 | 2007–2021 |
| MIYAZAKI MASASHIself | 10 | 2011–2015 |
| HITACHI LTD | 7 | 1994–2001 |
| ADVANTEST CORP | 5 | 2006–2011 |
| HITACHI CHEMICAL CO LTD | 4 | 1998–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 26 | 1989–2021 |
| Hadano, JP | 7 | 1994–2001 |
| Gunma, JP | 6 | 2008–2014 |
| Takasaki, JP | 5 | 2008–2015 |
| Anjo, JP | 2 | 2018–2021 |