LexDanaLexDanabeta
Inventor

YUICHI YANAKA

Inventor
JP

Overview

2→
Patents
2022–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary
B22FWorking metallic powder20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
B23KSoldering or unsoldering10%
C22CAlloys10%
C23CCoating metallic material10%
H01BCables10%
H01LSemiconductor devices10%
H05KPrinted circuits10%
PatentTitleYear
11,890,681Method for producing bonded object and semiconductor device and copper bonding paste202411,483,936Method for producing joined body, and joining material2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to SHOWA DENKO MATERIALS CO LTD (2)· patent assignee history
2022Patents assigned to HITACHI CHEMICAL CO LTD (1)· patent assignee history
2022–2024Based in JP· patent location history
2024Patents assigned to RESONAC CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SHOWA DENKO MATERIALS CO LTD22022–2024
HITACHI CHEMICAL CO LTD12022
RESONAC CORP12024
Locations
LocationPatentsSpan
JP22022–2024