Inventor
Aik Seng Kang
Inventor
Melaka, MY
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1067%
B24BMachines, devices, or processes for grinding or polishing17%
B24DTools for grinding, buffing or sharpening17%
PatentTitleYear
6,686,652'Locking lead tips and die attach pad for a leadless package apparatus and method'20046,629,880'Rotary mechanical buffing method for deflashing of molded integrated circuit packages'20036,452,255'Low inductance leadless package'20026,399,415'Electrical isolation in panels of leadless IC packages'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2004Patents assigned to NAT SEMICONDUCTOR CORP (4)· patent assignee history
2002–2004Based in Melaka, MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NAT SEMICONDUCTOR CORP | 4 | 2002–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Melaka, MY | 4 | 2002–2004 |