Inventor
Hee Kook Choi
Inventor
Cheonan-si, KR
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H05KPrinted circuits15%
Y10TTechnical subjects covered by former us classification11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B29CShaping or joining of plastics4%
H01RElectrically-conductive connections4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
7,825,495'Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package'20107,485,006'Memory module, socket and mounting method providing improved heat dissipating characteristics'20097,170,158'Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture'20077,098,407'Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate'20067,030,489'Multi-chip module having bonding wires and method of fabricating the same'20066,386,432'Semiconductor die pickup method that prevents electrostatic discharge'20026,348,363'Method for manufacturing a semiconductor package'20026,321,971'Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame'20015,979,739'Semiconductor die bonding apparatus having multiple bonding system'19995,886,405'Semiconductor device package having inner leads with slots'19995,811,132'Mold for semiconductor packages'19985,765,277'Die bonding apparatus with a revolving pick-up tool'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2010Patents assigned to SAMSUNG ELECTRONICS CO LTD (12)· patent assignee history
1998–2006Based in Chungcheongnam-do, KR· patent location history
1999–2007Based in Cheonan-si, KR· patent location history
1999Based in Cheonn, KR· patent location history
2009–2010Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 12 | 1998–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cheonan-si, KR | 5 | 1999–2007 |
| Chungcheongnam-do, KR | 4 | 1998–2006 |
| Seoul, KR | 2 | 2009–2010 |
| Cheonn, KR | 1 | 1999 |