Inventor
Feng Chen
Inventor
Singapore, SG
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H05BElectric heating15%
B24BMachines, devices, or processes for grinding or polishing9%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications6%
B24DTools for grinding, buffing or sharpening4%
H10DInorganic electric semiconductor devices4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted2%
G01VGeophysics2%
PatentTitleYear
10,856,384Lighting system with configurable color temperatures202010,448,471Lighting system with configurable dimming201910,299,337Systems to control dimming operations of a light-emitting diode light fixture using multiple dimming modes201910,104,731Combination dimmable driver20189,860,951'Systems and methods for balancing current among light-emitting diode boards'20189,844,114'Color mixing for solid state lighting using direct AC drives'20179,769,894'Controlling LED current from a constant voltage source'20178,536,635'Semiconductor structure and fabrication method thereof'20137,741,719'Integrated circuit system with dummy region'20107,446,039'Integrated circuit system with dummy region'20087,156,726'Polishing apparatus and method for forming an integrated circuit'20077,060,573'Extended poly buffer STI scheme'20066,964,598'Polishing apparatus and method for forming an integrated circuit'20056,664,190'Pre STI-CMP planarization scheme'20036,613,649'Method for buffer STI scheme with a hard mask layer as an oxidation barrier'20036,613,648'Shallow trench isolation using TEOS cap and polysilicon pullback'20036,528,886'Intermetal dielectric layer for integrated circuits'20036,451,687'Intermetal dielectric layer for integrated circuits'20026,443,809'Polishing apparatus and method for forming an integrated circuit'20026,376,376'Method to prevent CU dishing during damascene formation'20026,376,378'Polishing apparatus and method for forming an integrated circuit'20026,306,723'Method to form shallow trench isolations without a chemical mechanical polish'20016,284,644'IMD scheme by post-plasma treatment of FSG and TEOS oxide capping layer'20016,281,082'Method to form MOS transistors with a common shallow trench isolation and interlevel dielectric gap fill'20016,274,485'Method to reduce dishing in metal chemical-mechanical polishing'20016,204,137'Method to form transistors and local interconnects using a silicon nitride dummy gate technique'20016,103,569'Method for planarizing local interconnects'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2010Patents assigned to CHARTERED SEMICONDUCTOR MFG (19)· patent assignee history
2000–2010Based in Singapore, SG· patent location history
2002–2003Patents assigned to LUCENT TECHNOLOGIES INC (2)· patent assignee history
2002Based in Mandarin Gardens, SG· patent location history
2013Patents assigned to CHANG YUAN-SUNG (1)· patent assignee history
2013Based in Taoyuan County, TW· patent location history
2017–2020Patents assigned to ABL IP HOLDING LLC (7)· patent assignee history
2017Patents assigned to ALB IP HOLDING LLC (1)· patent assignee history
2017–2020Based in Hoffman Estates, IL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHARTERED SEMICONDUCTOR MFG | 19 | 2000–2010 |
| ABL IP HOLDING LLC | 7 | 2017–2020 |
| LUCENT TECHNOLOGIES INC | 2 | 2002–2003 |
| ALB IP HOLDING LLC | 1 | 2017 |
| CHANG YUAN-SUNG | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 18 | 2000–2010 |
| Hoffman Estates, Illinois, US | 7 | 2017–2020 |
| Taoyuan County, TW | 1 | 2013 |
| Mandarin Gardens, SG | 1 | 2002 |