Inventor

Shoichi Yamauchi

Inventor

Obu, JP

Overview

2001–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 33 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary

H10DInorganic electric semiconductor devices29%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%

C04BLime, magnesia6%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%

H01LSemiconductor devices4%

D06MTreatment, not provided for elsewhere in class d06, of fibres, threads, yarns, fabrics, feathers or fibrous goods made from such materials2%

G04BMechanically-driven clocks or watches2%

PatentTitleYear

10,696,022Composite plate and production method therefor2020 10,682,831Composite plate and method for producing same2020 10,550,040Red zirconia sintered body and method for manufacturing the same2020 9,919,971'Zirconia sintered body and use thereof'2018 9,174,877'Colored translucent zirconia sintered body, its production process and its use'2015 9,034,721'Method for manufacturing semiconductor substrate'2015 8,956,947'Method for manufacturing semiconductor substrate'2015 8,835,276'Method for manufacturing semiconductor substrate'2014 RE044236'Method for manufacturing semiconductor device'2013 7,811,907'Method for manufacturing semiconductor device and epitaxial growth equipment'2010 7,776,710'Manufacturing method of semiconductor wafer having a trench structure and epitaxial layer'2010 7,642,178'Semiconductor device, method for manufacturing the same and method for evaluating the same'2010 7,633,123'Semiconductor device having super junction structure'2009 7,601,603'Method for manufacturing semiconductor device'2009 7,553,731'Method of manufacturing semiconductor device'2009 7,517,771'Method for manufacturing semiconductor device having trench'2009 7,465,990'Semiconductor device having super junction structure'2008 7,417,284'Semiconductor device and method of manufacturing the same'2008 7,364,980'Manufacturing method of semiconductor substrate'2008 7,342,265'Vertical-type semiconductor device having repetitive-pattern layer'2008 7,342,422'Semiconductor device having super junction structure and method for manufacturing the same'2008 7,170,119'Vertical type semiconductor device'2007 7,063,751'Semiconductor substrate formed by epitaxially filling a trench in a semiconductor substrate with a semiconductor material after smoothing the surface and rounding the corners'2006 7,037,789'Stabilization of dopant concentration in semiconductor device having epitaxially-filled trench'2006 7,026,248'Method for manufacturing semiconductor device with semiconductor region inserted into trench'2006 6,836,001'Semiconductor device having epitaxially-filled trench and method for manufacturing semiconductor device having epitaxially-filled trench'2004 6,642,577'Semiconductor device including power MOSFET and peripheral device and method for manufacturing the same'2003 6,534,380'Semiconductor substrate and method of manufacturing the same'2003 6,495,883'Trench gate type semiconductor device and method of manufacturing'2002 6,495,294'Method for manufacturing semiconductor substrate having an epitaxial film in the trench'2002 6,406,982'Method of improving epitaxially-filled trench by smoothing trench prior to filling'2002 6,251,754'Semiconductor substrate manufacturing method'2001 6,191,007'Method for manufacturing a semiconductor substrate'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2015Patents assigned to DENSO CORP (28)· patent assignee history

2001–2009Based in Obu, JP· patent location history

2007–2013Based in Nagoya, JP· patent location history

2008–2015Patents assigned to SUMCO CORP (8)· patent assignee history

2013–2015Patents assigned to YAMAUCHI SHOICHI (3)· patent assignee history

2013–2014Patents assigned to NOGAMI SYOUJI (2)· patent assignee history

2014–2015Based in Kariya, JP· patent location history

2015–2020Patents assigned to TOSOH CORP (5)· patent assignee history

2015–2020Based in Kanagawa, JP· patent location history

2018–2020Based in Ayase, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
DENSO CORP	28	2001–2015
SUMCO CORP	8	2008–2015
TOSOH CORP	5	2015–2020
YAMAUCHI SHOICHIself	3	2013–2015
NOGAMI SYOUJI	2	2013–2014

Locations

Location	Patents	Span
Obu, JP	12	2001–2009
Nagoya, JP	11	2007–2013
Ayase, JP	3	2018–2020
Kariya, JP	3	2014–2015
Kanagawa, JP	2	2015–2020