Inventor
Kengo Kajiwara
Inventor
Yokkaichi, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10BElectronic memory devices26%
H10DInorganic electric semiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H10NElectric solid-state devices not otherwise provided for9%
G11CStatic stores4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
11,018,152Method for etching bottom punch-through opening in a memory film of a multi-tier three-dimensional memory device202110,804,197Memory die containing stress reducing backside contact via structures and method of making the same20209,991,277Three-dimensional memory device with discrete self-aligned charge storage elements and method of making thereof20189,754,999'Vertical thin film transistors with surround gates'20179,673,257'Vertical thin film transistors with surround gates'20179,589,839'Method of reducing control gate electrode curvature in three-dimensional memory devices'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2021Patents assigned to SANDISK TECHNOLOGIES LLC (6)· patent assignee history
2017Patents assigned to SANDISK TECHNOLOGIES INC (1)· patent assignee history
2017–2021Based in Yokkaichi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANDISK TECHNOLOGIES LLC | 6 | 2017–2021 |
| SANDISK TECHNOLOGIES INC | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokkaichi, JP | 6 | 2017–2021 |