Inventor
COBY SCOTT GROVE
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1040%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
12,476,120Modular mainframe layout for supporting multiple semiconductor process modules or chambers202511,984,335FOUP or cassette storage for hybrid substrate bonding system202411,935,770Modular mainframe layout for supporting multiple semiconductor process modules or chambers202411,935,771Modular mainframe layout for supporting multiple semiconductor process modules or chambers2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to APPLIED MATERIALS INC (4)· patent assignee history
2024–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 4 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2024–2025 |