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Inventor

Izumi Arai

Inventor
Yokohama, JP

Overview

24→
Patents
1978–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1037%
H01JElectric discharge tubes or discharge lamps16%
H01LSemiconductor devices12%
C23CCoating metallic material5%
B01FMixing, e.g. dissolving, emulsifying or dispersing2%
B08BCleaning in general2%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%
C23FNon-mechanical removal of metallic material from surface2%
F01NGas-flow silencers or exhaust apparatus for machines or engines in general2%
F26BDrying solid materials or objects by removing liquid therefrom2%
PatentTitleYear
10,679,879Substrate processing apparatus202010,403,523Substrate processing apparatus20199,753,536'Electronic device'20179,640,416'Single-and dual-chamber module-attachable wafer-handling chamber'20179,349,620'Apparatus and method for pre-baking substrate upstream of process chamber'20169,340,640'Polyol for polyurethane preparation and polyurethane preparation method using same'20169,343,350'Anti-slip end effector for transporting workpiece using van der waals force'20168,422,214'Mobile electronic apparatus'20138,115,234'Semiconductor device'20128,083,856'Ultrasonic cleaning apparatus and ultrasonic cleaning method'20116,330,391'VTR signal processing circuit'20016,110,287'Plasma processing method and plasma processing apparatus'20005,858,258'Plasma processing method'19995,382,311'Stage having electrostatic chuck and plasma processing apparatus using same'19955,203,958'Processing method and apparatus'19935,164,034'Apparatus and method for processing substrate'19925,155,331'Method for cooling a plasma electrode system for an etching apparatus'19925,144,800'Exhaust manifold system for a transverse v-type engine'19925,089,083'Plasma etching method'19924,978,412'Plasma processing device'19904,963,713'Cooling of a plasma electrode system for an etching apparatus'19904,931,135'Etching method and etching apparatus'19904,133,756'Method for dehydrating a mixed dust slurry'19794,089,507'Method and apparatus for maintaining uniformity of mixed dust slurry stored in a basin'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–1979Patents assigned to SUMITOMO HEAVY INDUSTRIES (2)· patent assignee history
1990–2000Patents assigned to TOKYO ELECTRON LTD (10)· patent assignee history
1990–2013Based in Yokohama, JP· patent location history
1992–2016Based in Kyoto, JP· patent location history
2001–2011Based in Takasaki, JP· patent location history
2011–2017Patents assigned to ARAI IZUMI (5)· patent assignee history
2012–2020Based in Tokyo, JP· patent location history
2013–2017Patents assigned to KYOCERA CORP (2)· patent assignee history
2016–2020Patents assigned to ASM IP HOLDING BV (5)· patent assignee history
2016–2017Based in Nagaoka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOKYO ELECTRON LTD101990–2000
ARAI IZUMIself52011–2017
ASM IP HOLDING BV52016–2020
KYOCERA CORP22013–2017
SUMITOMO HEAVY INDUSTRIES21978–1979
Locations
LocationPatentsSpan
Yokohama, JP111990–2013
Tokyo, JP32012–2020
Nagaoka, JP32016–2017
Kyoto, JP21992–2016
Takasaki, JP22001–2011