Inventor
GEOL NAM
Inventor
KR
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices47%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
12,183,718Semiconductor package having a high reliability202411,894,346Semiconductor package having a high reliability202411,848,274Semiconductor package202311,705,430Semiconductor package including mold layer having curved cross-section shape202311,664,352Semiconductor package having a high reliability202311,462,479Semiconductor package202211,393,764Semiconductor package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to SAMSUNG ELECTRONICS CO LTD (7)· patent assignee history
2022–2024Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 7 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 7 | 2022–2024 |