Inventor
Se Woong Cha
Inventor
Gwangju-si, KR
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices31%
G06VImage or video recognition or understanding10%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G06KGraphical data reading6%
F21VFunctional features or details of lighting devices or systems thereof2%
PatentTitleYear
10,867,984Method of manufacturing a package-on-package type semiconductor package202010,784,178Wafer-level stack chip package and method of manufacturing the same202010,692,918Electronic device package and fabricating method thereof202010,672,699Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers202010,304,890Electronic device package and fabricating method thereof201910,290,621Method of manufacturing a package-on-package type semiconductor package201910,199,322Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers201910,115,705Semiconductor package and manufacturing method thereof20189,831,282Electronic device package and fabricating method thereof20179,818,685'Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers'20179,741,701'Method of manufacturing a package-on-package type semiconductor package'20179,431,447'Package of finger print sensor and fabricating method thereof'20169,406,639'Semiconductor package and manufacturing method thereof'20169,129,873'Package of finger print sensor and fabricating method thereof'20159,123,543'Semiconductor device and manufacturing method thereof'20158,946,883'Wafer level fan-out package with a fiducial die'20158,058,726'Semiconductor device having redistribution layer'20117,982,316'Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2020Patents assigned to AMKOR TECHNOLOGY INC (18)· patent assignee history
2011–2015Patents assigned to CHA SE WOONG (2)· patent assignee history
2011–2015Patents assigned to HWANG TAE KYUNG (2)· patent assignee history
2011–2015Patents assigned to JIN JUNG GI (2)· patent assignee history
2011–2015Patents assigned to KIM SEOK BONG (2)· patent assignee history
2011–2015Based in Seoul, KR· patent location history
2015–2020Based in Gyeonggi-do, KR· patent location history
2016–2020Based in Gwangju-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 18 | 2011–2020 |
| CHA SE WOONGself | 2 | 2011–2015 |
| HWANG TAE KYUNG | 2 | 2011–2015 |
| JIN JUNG GI | 2 | 2011–2015 |
| KIM SEOK BONG | 2 | 2011–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gwangju-si, KR | 8 | 2016–2020 |
| Gyeonggi-do, KR | 7 | 2015–2020 |
| Seoul, KR | 3 | 2011–2015 |