Inventor
Ki Cheol Bae
Inventor
Seoul, KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H01LSemiconductor devices20%
G06FElectric digital data processing10%
H05KPrinted circuits10%
H10DInorganic electric semiconductor devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
10,529,676Semiconductor assembly with package on package structure and electronic device including the same20209,582,051'Mobile communication terminal having radiant-heat sheet'20179,159,625'Semiconductor device'20158,802,494'Method of fabricating a semiconductor device having an interposer'20148,183,678'Semiconductor device having an interposer'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2015Patents assigned to AMKOR TECHNOLOGY INC (3)· patent assignee history
2012–2015Patents assigned to BAE KI CHEOL (3)· patent assignee history
2012–2014Patents assigned to LEE CHOON HEUNG (2)· patent assignee history
2012–2014Patents assigned to NA DO HYUN (2)· patent assignee history
2012–2017Based in Seoul, KR· patent location history
2015Based in Kyungki-do, KR· patent location history
2017–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2020Based in Suwon-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 3 | 2012–2015 |
| BAE KI CHEOLself | 3 | 2012–2015 |
| LEE CHOON HEUNG | 2 | 2012–2014 |
| NA DO HYUN | 2 | 2012–2014 |
| SAMSUNG ELECTRONICS CO LTD | 2 | 2017–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 3 | 2012–2017 |
| Suwon-si, KR | 1 | 2020 |
| Kyungki-do, KR | 1 | 2015 |