Inventor
Masahiko Kawakami
Inventor
Tsukubamirai, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
LOC15primary
LOC1552%
C23CCoating metallic material9%
G06FElectric digital data processing9%
B21JForging4%
F15BSystems acting by means of fluids in general4%
F16JPistons4%
H01HElectric switches4%
H02BBoards, substations or switching arrangements for the supply or distribution of electric power4%
H03MCoding4%
LOC024%
PatentTitleYear
D0900879Fluid pressure cylinder with lock mechanism2020D0900880Fluid pressure cylinder with lock mechanism2020D0900166Fluid pressure cylinder with lock mechanism2020D0900165Fluid pressure cylinder with lock mechanism2020D0899466Fluid pressure cylinder with lock mechanism2020D0899465Fluid pressure cylinder with lock mechanism2020D0888770Fluid pressure cylinder2020D0888769Fluid pressure cylinder2020D0888771Fluid pressure cylinder202010,570,934Fluidic cylinder2020D0820321Fluid pressure cylinder2018D0819700Fluid pressure cylinder2018D0805560Fluid pressure cylinder2017D0805559Fluid pressure cylinder20176,525,667'Operation indicator device and panel unit'20036,437,774'Display and input device and display and input system'20026,231,687'Lubrication treatment method for cold working of steel'20016,179,934'Aqueous phosphating composition and process for metal surfaces'20016,118,435'Display unit with touch panel'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2003Patents assigned to IDEC IZUMI CORP (3)· patent assignee history
2000–2003Based in Osaka, JP· patent location history
2001Patents assigned to HENKEL CORP (2)· patent assignee history
2001Based in Nagoya, JP· patent location history
2017–2020Patents assigned to SMC CORP (14)· patent assignee history
2017–2020Based in Tsukubamirai, JP· patent location history
2020Based in Moriya, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SMC CORP | 14 | 2017–2020 |
| IDEC IZUMI CORP | 3 | 2000–2003 |
| HENKEL CORP | 2 | 2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tsukubamirai, JP | 8 | 2017–2020 |
| Moriya, JP | 6 | 2020 |
| Osaka, JP | 3 | 2000–2003 |
| Nagoya, JP | 2 | 2001 |