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Inventor

Manabu Horita

Inventor
Tokyo, JP

Overview

3→
Patents
1996–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
B23KSoldering or unsoldering14%
G05DSystems for controlling or regulating non-electric variables14%
H01LSemiconductor devices14%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems14%
PatentTitleYear
10,192,811Power semiconductor device20196,614,101'Lead frame with raised leads and plastic packaged semiconductor device using the same'20035,500,502'Bonding method and apparatus'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–2019Patents assigned to MITSUBISHI ELECTRIC CORP (3)· patent assignee history
1996Based in Fukuoka, JP· patent location history
2003–2019Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI ELECTRIC CORP31996–2019
Locations
LocationPatentsSpan
Tokyo, JP22003–2019
Fukuoka, JP11996