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Inventor

HUNT JIANG

Inventor
US

Overview

2→
Patents
2023–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01FMagnets17%
H10DInorganic electric semiconductor devices17%
PatentTitleYear
12,002,787Multi-die package structure and multi-die co-packing method202411,652,0293-D package structure for isolated power module and the method thereof2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023Patents assigned to MONOLITHIC POWER SYSTEMS INC (1)· patent assignee history
2023–2024Based in US· patent location history
2024Patents assigned to CHENGDU MONOLITHIC POWER SYS (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHENGDU MONOLITHIC POWER SYS12024
MONOLITHIC POWER SYSTEMS INC12023
Locations
LocationPatentsSpan
US22023–2024