Inventor
GUY REGEV
Inventor
US
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables25%
H01LSemiconductor devices25%
H04LTransmission of digital information, e.g. telegraphic communication25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to INVENSAS BONDING TECH INC (1)· patent assignee history
2022–2024Based in US· patent location history
2024Patents assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC | 1 | 2024 |
| INVENSAS BONDING TECH INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 2 | 2022–2024 |