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Inventor

Keiichi Hatakeyama

Inventor
Tsukuba, JP

Overview

10→
Patents
2003–2013
Patent span
Electricity
Primary field (CPC H)

Patents· 10 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
C09JAdhesives13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y10TTechnical subjects covered by former us classification11%
C08LCompositions of macromolecular compounds9%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
H05KPrinted circuits7%
B23KSoldering or unsoldering4%
B28DWorking stone or stone-like materials4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
8,404,564'Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them'20138,232,185'Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film'20128,198,176'Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device'20128,119,737'Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device'20128,071,465'Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device'20118,034,659'Production method of semiconductor device and bonding film'20117,947,779'Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer'20117,517,724'Dicing/die bonding sheet'20097,070,670'Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device'20066,602,132'Game system and computer-readable storage medium carrying program therefor'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003Based in Nagoya, JP· patent location history
2006–2013Patents assigned to HITACHI CHEMICAL CO LTD (9)· patent assignee history
2006–2013Based in Tsukuba, JP· patent location history
2011–2013Patents assigned to HATAKEYAMA KEIICHI (5)· patent assignee history
2011–2013Patents assigned to NAKAMURA YUUKI (4)· patent assignee history
2012–2013Patents assigned to KATAYAMA YOUJI (2)· patent assignee history
2012–2013Patents assigned to KITAKATSU TSUTOMU (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI CHEMICAL CO LTD92006–2013
HATAKEYAMA KEIICHIself52011–2013
NAKAMURA YUUKI42011–2013
KATAYAMA YOUJI22012–2013
KITAKATSU TSUTOMU22012–2013
Locations
LocationPatentsSpan
Tsukuba, JP92006–2013
Nagoya, JP12003