Inventor
Johannes Stahr
Inventor
St. Lorenzen, AT
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits31%
Y10TTechnical subjects covered by former us classification17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01LSemiconductor devices13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
F21VFunctional features or details of lighting devices or systems thereof2%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact2%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application2%
H01FMagnets2%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%
PatentTitleYear
11,049,778Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity202110,867,888Component carrier comprising at least one heat pipe and method for producing said component carrier202010,861,636Inductor made of component carrier material comprising electrically conductive plate structures202010,863,631Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure202010,779,413Method of embedding a component in a printed circuit board202010,665,526Component carrier comprising at least one heat pipe and method for producing said component carrier202010,617,012Methods of manufacturing flexible printed circuit boards202010,426,040Method for producing a circuit board element201910,356,904Conductor track with enlargement-free transition between conductor path and contact structure201910,332,818Efficient heat removal from component carrier with embedded diode201910,283,680Method for the production of an electronic module having an electronic component embedded therein201910,219,384Circuit board structure201910,187,997Method for making contact with a component embedded in a printed circuit board201910,165,685Printed circuit board20189,980,380Printed circuit board consisting of at least two printed circuit board regions20189,781,845'Semi-finished product for the production of a printed circuit board and method for producing the same'20179,674,960'Printed circuit board comprising an electronic component integrated therein'20179,491,862'Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board'20169,480,172'Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board'20169,418,930'Power module'20169,253,888'Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product'20169,055,706'Method for integrating an electronic component into a printed circuit board'20158,789,271'Method for integrating an electronic component into a printed circuit board'20148,705,905'Printed circuit board element and method for the production thereof'20148,685,196'Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method'20148,541,689'Method for removing a part of a planar material layer and multilayer structure'20138,541,690'Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component'20138,500,938'Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board'20138,388,792'Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor'20138,039,755'Method for manufacturing a printed circuit board element as well as a printed circuit board element'20117,552,525'Method for the production of a circuit board element'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2021Patents assigned to AUSTRIA TECH & SYSTEM TECH (17)· patent assignee history
2009–2014Based in Bruck an der Mur, AT· patent location history
2013–2016Patents assigned to STAHR JOHANNES (10)· patent assignee history
2013–2015Patents assigned to LEITGEB MARKUS (5)· patent assignee history
2013–2016Patents assigned to WEIDINGER GERALD (4)· patent assignee history
2013–2014Based in Bruck, AT· patent location history
2014–2021Based in St. Lorenzen, AT· patent location history
2016–2021Patents assigned to AT & S AUSTRIA TECH & SYSTEMTECHNIK AG (15)· patent assignee history
2017–2020Based in St.Lorenzen, AT· patent location history
2019–2020Based in St. Lorenzen im Mürztal, AT· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AUSTRIA TECH & SYSTEM TECH | 17 | 2009–2021 |
| AT & S AUSTRIA TECH & SYSTEMTECHNIK AG | 15 | 2016–2021 |
| STAHR JOHANNESself | 10 | 2013–2016 |
| LEITGEB MARKUS | 5 | 2013–2015 |
| WEIDINGER GERALD | 4 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| St. Lorenzen, AT | 19 | 2014–2021 |
| Bruck, AT | 5 | 2013–2014 |
| Bruck an der Mur, AT | 3 | 2009–2014 |
| St. Lorenzen im Mürztal, AT | 2 | 2019–2020 |
| St.Lorenzen, AT | 2 | 2017–2020 |