Inventor
NICK SAMRA
Inventor
US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
G01RMeasuring electric variables10%
G11CStatic stores10%
H03KPulse technique10%
G02BOptical elements, systems or apparatus7%
H10DInorganic electric semiconductor devices7%
H10HInorganic light-emitting semiconductor devices having potential barriers7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G05FSystems for regulating electric or magnetic variables3%
PatentTitleYear
12,174,440Photonics package integration202412,063,041Flip flop standard cell202411,824,541Flip flop standard cell202311,651,996Semiconductor device and method for manufacturing the same202311,460,651Photonics package integration202211,437,982Flip flop standard cell202211,158,448Packaging layer inductor202111,152,332Modular voltage regulators2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2021–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 8 | 2021–2024 |