Inventor

Lei Duan

Inventor
San Jose, CA, US

Overview

25→
Patents
2001–2019
Patent span
Physics
Primary field (CPC G)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing29%
G10LSpeech analysis techniques or speech synthesis14%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
A61KPreparations for medical, dental or toiletry purposes7%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations5%
G06KGraphical data reading5%
G06NComputing arrangements based on specific computational models5%
H01LSemiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
10,376,572Immunogenic composition for preventing pneumococcal diseases and preparation method thereof20199,959,579Derivation and presentation of expertise summaries and interests for users20189,750,728'Method and pharmaceutical composition for inhibiting PI3K/AKT/mTOR signaling pathway'20179,646,032'Temporal user engagement features'20179,545,396'Method and pharmaceutical composition for inhibiting PI3K/AKT/mTOR signaling pathway'20179,514,216'Automatic classification of segmented portions of web pages'20169,196,534'Method for preparing semiconductor devices applied in flip chip technology'20159,104,751'Supplemental search results having social connection endorsement data on a SERP'20159,015,174'Likefarm determination'20158,849,725'Automatic classification of segmented portions of web pages'20148,778,735'Packaging method of molded wafer level chip scale package (WLCSP)'20148,666,984'Unsupervised message clustering'20148,563,361'Packaging method of molded wafer level chip scale package (WLCSP)'20138,486,803'Wafer level packaging method of encapsulating the bottom and side of a semiconductor chip'20138,112,436'Semantic and text matching techniques for network search'20127,974,970'Detection of undesirable web pages'20117,392,186'System and method for effectively implementing an optimized language model for speech recognition'20087,353,173'System and method for Mandarin Chinese speech recognition using an optimized phone set'20087,353,174'System and method for effectively implementing a Mandarin Chinese speech recognition dictionary'20086,778,949'Method and system to analyze, transfer and generate language expressions using compiled instructions to manipulate linguistic structures'20046,721,697'Method and system for reducing lexical ambiguity'20046,529,865'System and method to compile instructions to manipulate linguistic structures into separate functions'20036,442,524'Analyzing inflectional morphology in a spoken language translation system'20026,356,865'Method and apparatus for performing spoken language translation'20026,223,150'Method and apparatus for parsing in a spoken language translation system'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2008Patents assigned to SONY CORP (9)· patent assignee history
2001–2008Patents assigned to SONY ELECTRONICS INC (9)· patent assignee history
2001–2004Based in Cupertino, CA, US· patent location history
2008–2018Based in San Jose, CA, US· patent location history
2012–2015Patents assigned to DUAN LEI (8)· patent assignee history
2013–2015Patents assigned to ALPHA & OMEGA SEMICONDUCTOR (4)· patent assignee history
2013Based in Songjiang, CN· patent location history
2014–2015Based in Shanghai, CN· patent location history
2015–2018Patents assigned to MICROSOFT TECHNOLOGY LICENSING LLC (4)· patent assignee history
2017Based in Evanston, IL, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SONY CORP92001–2008
SONY ELECTRONICS INC92001–2008
DUAN LEIself82012–2015
ALPHA & OMEGA SEMICONDUCTOR42013–2015
MICROSOFT TECHNOLOGY LICENSING LLC42015–2018
Locations
LocationPatentsSpan
San Jose, California, US122008–2018
Cupertino, California, US62001–2004
Evanston, Illinois, US22017
Shanghai, CN22014–2015
Songjiang, CN22013