Inventor
David Fraser Rae
Inventor
San Diego, CA, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
10,410,971Thermal and electromagnetic interference shielding for die embedded in package substrate201910,163,687System, apparatus, and method for embedding a 3D component with an interconnect structure20189,985,010System, apparatus, and method for embedding a device in a faceup workpiece20189,806,048'Planar fan-out wafer level packaging'20179,679,873'Low profile integrated circuit (IC) package comprising a plurality of dies'20179,601,472'Package on package (POP) device comprising solder connections between integrated circuit device packages'20179,601,435'Semiconductor package with embedded components and method of making the same'20179,484,327'Package-on-package structure with reduced height'20169,355,898'Package on package (PoP) integrated device comprising a plurality of solder resist layers'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2019Patents assigned to QUALCOMM INC (9)· patent assignee history
2016–2019Based in San Diego, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 9 | 2016–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Diego, California, US | 9 | 2016–2019 |