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Inventor

Toru Nomura

Inventor
Hyogo, JP

Overview

24→
Patents
1994–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
G03GElectrography5%
G06FElectric digital data processing5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
B25JManipulators3%
B29BPreparation or pretreatment of the material to be shaped3%
B29CShaping or joining of plastics3%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts3%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering3%
PatentTitleYear
10,988,603Molded resin strand202110,949,318Display control apparatus, display control method, and recording medium on which display control program is recorded202110,915,045Fixing apparatus and image forming apparatus that set target temperatures of heat generating elements for heating a developer image in each of a plurality of regions202110,901,349Image forming apparatus and image heating apparatus for controlling a heat generating quantity of a plurality of heating elements202110,887,331Information processing apparatus and influence-process extraction method20219,925,660'Method for positioning micro-tool and micro-manipulator device'20187,338,838'Resin-encapsulation semiconductor device and method for fabricating the same'20087,309,624'Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame'20077,125,751'Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions'20067,026,192'Terminal land frame and method for manufacturing the same'20066,909,168'Resin encapsulation semiconductor device utilizing grooved leads and die pad'20056,710,430'Resin-encapsulated semiconductor device and method for manufacturing the same'20046,692,991'Resin-encapsulated semiconductor device and method for manufacturing the same'20046,680,524'Semiconductor device and method for fabricating the same'20046,680,220'Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package'20046,674,154'Lead frame with multiple rows of external terminals'20046,667,541'Terminal land frame and method for manufacturing the same'20036,498,393'Semiconductor device and method for the fabrication thereof'20026,225,146'Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device'20015,977,615'Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device'19995,759,367'Gas sensor'19985,708,295'Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same'19985,336,367'Solid-state imaging device and method of manufacturing the same'19945,321,249'Solid-state imaging device and method of manufacturing the same'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (14)· patent assignee history
1998–2001Patents assigned to MATSUSHITA ELECTRONICS CORP (3)· patent assignee history
1998Patents assigned to FIGARO ENG (1)· patent assignee history
1998–2008Based in Hyogo, JP· patent location history
1998–2005Based in Osaka, JP· patent location history
2004–2006Based in Amagasaki, JP· patent location history
2018–2021Based in Tokyo, JP· patent location history
2021Patents assigned to CANON KK (2)· patent assignee history
2021Patents assigned to NEC CORP (2)· patent assignee history
2021Based in Susono, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD141994–2008
MATSUSHITA ELECTRONICS CORP31998–2001
CANON KK22021
NEC CORP22021
FIGARO ENG11998
Locations
LocationPatentsSpan
Hyogo, JP91998–2008
Amagasaki, JP52004–2006
Tokyo, JP32018–2021
Susono, JP22021
Osaka, JP21998–2005