Inventor
Ae-nee Jang
Inventor
Seoul, KR
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
10,211,176Semiconductor package20199,859,204'Semiconductor devices with redistribution pads'20189,570,423'Semiconductor package and method of manufacturing the semiconductor package'20179,373,574'Semiconductor packages and methods of forming the same'20169,343,437'Semiconductor package devices'20169,299,631'Stack-type semiconductor package'20169,245,816'Semiconductor package and method of manufacturing the semiconductor package'20169,159,705'Semiconductor chip connecting semiconductor package'20159,024,448'Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2019Patents assigned to SAMSUNG ELECTRONICS CO LTD (9)· patent assignee history
2015–2019Based in Seoul, KR· patent location history
2015Based in Gwangjin-gu, KR· patent location history
2016Patents assigned to JANG AE-NEE (4)· patent assignee history
2016Patents assigned to KIM YOUNG-LYONG (2)· patent assignee history
2016Patents assigned to JANG CHUL-YONG (1)· patent assignee history
2016Patents assigned to JANG JAEGWON (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 9 | 2015–2019 |
| JANG AE-NEEself | 4 | 2016 |
| KIM YOUNG-LYONG | 2 | 2016 |
| JANG CHUL-YONG | 1 | 2016 |
| JANG JAEGWON | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 8 | 2015–2019 |
| Gwangjin-gu, KR | 1 | 2015 |