Inventor
MOHANRAJ PRABHUGOUD
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01LSemiconductor devices16%
G06FElectric digital data processing12%
H01RElectrically-conductive connections8%
G01RMeasuring electric variables4%
G02BOptical elements, systems or apparatus4%
H01BCables4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
12,444,664Loading frame for high I/O count packaged semiconductor chip202512,293,956Boiling enhancement structures for immersion cooled electronic systems202512,248,344Technologies for liquid cooling interfaces202512,176,643Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation202412,133,357Cold plate architecture for liquid cooling of devices202412,127,363Compression mounted technology (CMT) socket retention mechanisms to board or interposer202411,683,890Reflow grid array to support late attach of components202311,656,247Micro-coaxial wire interconnect architecture202311,621,237Interposer and electronic package202311,449,111Scalable, high load, low stiffness, and small footprint loading mechanism2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (9)· patent assignee history
2022–2025Based in US· patent location history
2025Patents assigned to SK HYNIX NAND PRODUCT SOLUTIONS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 9 | 2022–2025 |
| SK HYNIX NAND PRODUCT SOLUTIONS CORP | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2022–2025 |