Inventor
Fengsheng Xi
Inventor
Ningbo, CN
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Nprimary
H04NPictorial communication, e.g. television14%
H05KPrinted circuits12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B29CShaping or joining of plastics11%
B29LIndexing scheme associated with subclass b29c, relating to particular articles11%
G02BOptical elements, systems or apparatus11%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%
H01LSemiconductor devices8%
H04MTelephonic communication8%
G01SRadio direction-finding1%
PatentTitleYear
11,039,052Camera module and molding circuit board assembly, circuit board and application thereof202110,908,324Molded photosensitive assembly of array imaging module202110,578,837Molded photosensitive assembly for array imaging module for electronic device202010,582,097Photosensitive assembly and camera module and manufacturing method thereof202010,321,028Photosensitive assembly and camera module and manufacturing method thereof201910,274,694Manufacturing method of a molded photosensitive assembly of an array imaging module201910,175,447Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device201910,148,859Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device201810,126,519Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device201810,033,913Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device20189,906,700'Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device'20189,826,132'Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device'20179,781,325'Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2021Patents assigned to NINGBO SUNNY OPOTECH CO LTD (13)· patent assignee history
2017–2021Based in Ningbo, CN· patent location history
2021Based in Zhejiang, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NINGBO SUNNY OPOTECH CO LTD | 13 | 2017–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ningbo, CN | 12 | 2017–2021 |
| Zhejiang, CN | 1 | 2021 |