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Inventor

Takabumi Omori

Inventor
Tokyo, JP

Overview

3→
Patents
2003–2011
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits30%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
7,892,651'Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate'20116,680,152'Photosensitive resin composition'20046,528,552'Resist composition excellent in flame resistance'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2011Patents assigned to MITSUBISHI GAS CHEMICAL CO (3)· patent assignee history
2003–2011Based in Tokyo, JP· patent location history
2011Patents assigned to PI R & D CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI GAS CHEMICAL CO32003–2011
PI R & D CO LTD12011
Locations
LocationPatentsSpan
Tokyo, JP32003–2011